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USB2601 PDF预览

USB2601

更新时间: 2024-01-25 20:28:26
品牌 Logo 应用领域
美国微芯 - MICROCHIP /
页数 文件大小 规格书
30页 272K
描述
4th Generation USB 2.0 Flash Media Controller with Integrated Card Power FETs & HS Hub

USB2601 技术参数

生命周期:Transferred零件包装代码:QFP
包装说明:TFQFP,针数:128
Reach Compliance Code:unknown风险等级:5.63
Is Samacsys:N主机接口标准:USB
JESD-30 代码:S-PQFP-G128长度:14 mm
端子数量:128最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:TFQFP封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE, FINE PITCH认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压:1.98 V
最小供电电压:1.62 V标称供电电压:1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.4 mm端子位置:QUAD
宽度:14 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

USB2601 数据手册

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USB2601/USB2602  
4th Generation USB 2.0 Flash Media Controller with  
Integrated Card Power FETs & HS Hub  
- Double Buffered Bulk Endpoint  
Hub Controller  
- Bi-directional 512 Byte Buffer for Bulk End-  
point  
• Provides Three USB 2.0 Downstream Ports via  
internal USB 2.0 Hub  
- 64 Byte RX Control Endpoint Buffer  
- 64 Byte TX Control Endpoint Buffer  
• Internal Program Memory Interface  
- 64K Byte Internal Code Space  
- Multi Transaction Translator for FS/LS  
devices attached  
Flash Media Controller  
• On Board 24MHz Crystal Driver Circuit  
• Can be clocked by an external 24MHz source  
• On-Chip 1.8V Regulator for Low Power Core  
Operation  
• Internal PLL for 480MHz USB 2.0 Sampling, Con-  
figurable MCU clock  
• 11 GPIOs for special function use: LED indicators,  
button inputs, power control to memory devices,  
etc.  
• Complete System Solution for interfacing Smart-  
MediaTM (SM) or xD Picture CardTM (xD)1, Mem-  
ory StickTM (MS), High Speed Memory Stick  
(HSMS), Memory Stick PRO (MSPRO), MS  
DuoTM, Secure Digital (SD), Mini-Secure Digital  
(Mini-SD), TransFlash (SD), MultiMediaCardTM  
(MMC), Reduced Size MultiMediaCard (RS-  
MMC), NAND Flash, Compact FlashTM (CF) and  
CF UltraTM I & II, and CF form-factor ATA hard  
drives to USB 2.0 bus  
- Inputs capable of generating interrupts with  
either edge sensitivity  
- Supports USB Bulk Only Mass Storage Com-  
pliant Bootable BIOS  
• Configuration of Hub and Flash Media features  
controlled either by internal defaults or via single  
external EEPROM. User configurable features:  
• Support for simultaneous operation of all above  
devices. (only one at a time of each of the follow-  
ing groups supported: CF or ATA drive, SM or XD  
or NAND, SD or MMC)  
• On-Chip 4-Bit High Speed Memory Stick and MS  
PRO Hardware Circuitry  
• On-Chip firmware reads and writes High Speed  
Memory Stick and MS PRO  
• 1-bit ECC correction performed in hardware for  
maximum efficiency  
- Full or Partial Card compliance checking  
- LUN configuration and assignment  
- Write Protect Polarity  
- Cover Switch operation for xD compliance  
- Inquiry Command operation  
- SD Write Protect operation  
- Older CF card support  
- Force USB 1.1 reporting  
• Hardware support for SD Security Command  
Extensions  
- Internal or External Power FET operation  
• 3.3 Volt I/O with 5V input tolerance on VBUS, Port  
Power and Over-Current Sense pins  
• On-chip power FETs for supplying flash media  
card power with minimum board components  
• 8051 8 bit microprocessor  
• Compatible with Microsoft WinXP, WinME, Win2K  
SP3&4, Apple OS10 and Linux Multi-LUN Mass  
Storage Class Drivers  
• Win2K, Win98/98SE and Apple OS8.6 and OS9  
Multi-LUN Mass Storage Class Drivers are avail-  
able from Microchip  
- Provides low speed control functions  
• 128-Pin TQFP Package (1.0mm height, 14mm  
x14mm footprint); RoHS compliant package also  
available  
- 30 MHz execution speed at 4 cycles per  
instruction average  
- 12K Bytes of internal SRAM for general pur-  
pose scratchpad  
- 768 Bytes of internal SRAM for general pur-  
pose scratchpad or program execution while  
re-flashing external ROM  
1.xD Picture Card not applicable to USB2601  
2004 - 2016 Microchip Technology Inc.  
DS00002119A-page 1  

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