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UPD7759GC-3BH PDF预览

UPD7759GC-3BH

更新时间: 2024-09-27 22:17:43
品牌 Logo 应用领域
日电电子 - NEC 语音合成PC
页数 文件大小 规格书
18页 183K
描述
ADPCM SPEECH SYNTHESIZER LSIs

UPD7759GC-3BH 数据手册

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DATA SHEET  
MOS INTEGRATED CIRCUIT  
µPD7759  
ADPCM SPEECH SYNTHESIZER LSIs  
The µPD7759 is an external ROM type speech synthesis LSI employing the waveform coding  
method. In addition to the ROM capability of up to 1 Mbit, the µPD7759 realizes the synthesis of  
speech sounds of any length by using the ADPCM data transferred from an external ROM.  
As the synthesizing method, it adopts the ADPCM method and the PCM + waveform element method.  
The ADPCM method is suitable for synthesizing clear and natural speech sounds, and the PCM + waveform  
element method is for the synthesis of sound effects and melodies. And by using them together, the  
µPD7759 realizes the long-time synthesis of high-quality sounds.  
Because of the short turn-around time of speech analysis, the µPD7759 can perform the quick system  
development using a PROM, or the evaluation of an on-chip ROM type of the µPD7755 family.  
FEATURES  
Synthesizing method  
Sampling frequency  
Bit rate (speech)  
: ADPCM, PCM + waveform element methods used together  
: 5, 6 or 8 kHz  
: 20 to 32 K bps  
: 256 (MAX.)  
Number of Messages  
External speech data ROM  
Parameters  
Synthesizing time  
Speech data ROM  
(External)  
Note2  
Melodies & sound effects  
(PCM + waveform element)  
Note1  
Speech (ADPCM)  
50 sec. (TYP.)  
Products  
µPD7759  
1 Mbits  
340 sec. (TYP.)  
Note 1. The synthesizing time for the speech is the value for a 6 kHz sampling.  
2. The synthesizing time for the melodies & sound effects is variable according to their tone.  
Speech output  
Host CPU interface  
Standby mode  
: Current sink type analog output, 9-bit D/A converter  
: Compatible with a 4/8-bit CPU  
: Pop-noise preventive circuit incorporated  
: 2.7 to 5.5 V  
Supply voltage  
CMOS technology  
ORDERING INFORMATION  
Part Number  
Package  
Quality grade  
Standard  
µPD7759C  
40-pin plastic DIP (600 mil)  
52-pin plastic QFP (14 mm)  
µPD7759GC-3BH  
Standard  
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by  
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.  
The information in this document is subject to change without notice.  
Document No. IC-2323A  
(O.D.No. IC-6960D)  
The mark shows revised points.  
Date Published January 1993  
Printed in Japan  
1988, 1993  
©

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