TLOU248(F)
TOSHIBA LED Lamp InGaAℓP Orange Light Emission
TLOU248(F)
Panel Circuit Indicator
Unit in mm
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Lead(Pb)-free products (lead: Sn-Ag-Cu)
InGaAℓP orange LED
Elliptical lens: Colored transparent lens
Wide radiation
Low drive current, high intensity orange light emission
Plastic molded colored transparent lens provides for high contrast of
on−off ratio.
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Fast response time, capable of pulse operation.
Applications: Suitable for outdoor message signboard, full color panel,
backlight.
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Forward current
Symbol
Rating
Unit
I
30
4
mA
V
F
Reverse voltage
V
P
R
D
JEDEC
JEITA
―
―
Power dissipation
72
mW
°C
Operating temperature range
Storage temperature range
T
opr
−30~85
−40~120
TOSHIBA
4-5AP1
T
stg
°C
Weight: 0.3 g(Typ.)
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical and Optical Characteristics (Ta = 25°C)
Characteristic
Forward voltage
Symbol
Test Condition
Min
Typ.
Max
Unit
V
IF = 20 mA
= 4 V
―
―
85
―
―
―
2.0
―
2.4
50
―
―
―
―
V
F
Reverse current
I
V
μA
R
R
Luminous intensity
I
IF = 20 mA
(Note)
300
(612)
15
mcd
nm
nm
nm
V
Peak emission wavelength
Spectral line half width
Dominant wavelength
λ
I
F
I
F
I
F
= 20 mA
= 20 mA
= 20 mA
P
Δλ
λd
605
Note:Lamps are classified into the following ranks according to their luminous intensity. Each packing box includes
single Luminous Intensity class.
N: 85-230mcd, P: 153-414mcd, Q: 272mcd-
Precaution
Please be careful of the followings
Soldering temperature: 260°C max
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Soldering time: 3 s max
(Soldering portion of lead: below the lead stopper of the device)
If the lead is formed, the lead should be formed up to below the lead stopper of the device without forming stress
to the resin. Soldering should be performed after lead forming.
This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure
that it will not be affected by this IR light.
1
2007-10-01