TK72E12N1
4. Absolute Maximum Ratings (Note) (Ta = 25 unless otherwise specified)
Characteristics
Symbol
Rating
Unit
V
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulsed)
Power dissipation
VDSS
VGSS
ID
120
±20
(Silicon limit)
(Note 1), (Note 2)
(Note 1), (Note 3)
(Note 1)
179
A
ID
72
(t = 1 ms)
IDP
360
(Tc = 25)
PD
255
W
mJ
A
Single-pulse avalanche energy
Avalanche current
(Note 4)
EAS
IAR
256
72
Channel temperature
Storage temperature
Tch
Tstg
150
-55 to 150
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
5. Thermal Characteristics
Characteristics
Symbol
Max
Unit
Channel-to-case thermal resistance
Channel-to-ambient thermal resistance
Rth(ch-c)
Rth(ch-a)
0.49
83.3
/W
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Limited by silicon chip capability. Package limit is 100 A.
Note 3: Device mounted with heatsink so that Rth(ch-a) becomes 2.77/W.
Note 4: VDD = 80 V, Tch = 25 (initial), L = 48.3 µH, IAR = 72 A
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
2012-08-09
Rev.1.0
2