Datasheet > TH74KB26AVWJNPG

TH74KB26AVWJNPG

更新时间： 2023-02-15 00:00:00

品牌	Logo	应用领域
爱特美尔 - ATMEL		/
页数	文件大小	规格书
20页	1122K
描述
CCD Sensor, 2.50V, Square, Surface Mount, CERAMIC, J LEAD PACKAGE-84

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TH74KB26AVWJNPG 数据手册

TH7426A/27A

NEAR INFRARED InGaAs LINEAR IMAGE SENSOR

300 PIXELS

DESCRIPTION

These devices are based on a 300 InGaAs photodiode li-

near array, with a 26µm pitch, using an in line pixel layout or

a staggered pixel layout.

Two 150:1 CCD multiplexor chips, offering memory and de-

layed readout capability, are hybridized on both sides of the

photodiode array so as to build a complete module.

Specially designed to allow an accurate butting, those mo-

dules could be tied together on request so as to provide an

array extension with only one dead pixel at the splice.

These devices are also available in a full CMOS interface

version :

TH74KA26A/TH74KA27A or TH74KB26A/TH74KB27A.

MAIN FEATURES

APPLICATIONS

n Near infrared spectral response: 0.8µm to 1.7µm

n Room temperature operation

n Suited for Near Infrared imaging

n Thermal imaging in the 200°C to 800°C range

ⁿHigh resolution multichannel spectrometry

n Fluorescence free Raman spectrophotometry

ⁿOn-line inspection and monitoring

ⁿLow noise

n High detectivity, wide dynamic range (>10 000)

ⁿHigh linearity, high Modulation Transfer Function (MTF)

ⁿHigh output data rate : up to 6 MHz

ⁿIntrinsic antiblooming

ⁿBuilt in thermoelectric cooler and temperature sensor

available

ⁿAccurate mechanical indexes (ready to mount)

SELECTION GUIDE

NUMBER OF

VIDEO OUTPUTS

REFERENCE

PIXEL COUNT

LAYOUT

PIXEL AREA

PITCH

TH7426A

TH7427A

TH7428A

TH7429A

299

599

In line

Staggered

In line

20x30µm²

30x30µm²

20x30µm²

30x30µm²

26µm

Staggered

March 1998

1/20

12 3 4 5 6 7...20

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