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TGL2210

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TGL2210 数据手册

TGL2210-SM

0.05ꢀ–ꢀ6.0 GHz 100 Watt VPIN Limiter

Evaluation Board PCB Information and Mounting Detail

TUNED PCB LAYOUT

Tuning stub (mils)

29.2

229.2

29.9

MOUNTING PATTERN

RF layer is 0.008” thick Rogers RO4003C. Metal layers are 0.5-oz copper. Microstrip 50 Ω line width is 0.050”. The microstrip line taper

at the connector interface is optimized for the Southwest Microwave end-launch connector 1092-02A-5.

The pad pattern shown has been developed and tested for optimized assembly at Qorvo. The PCB land pattern has been developed to

accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process

development is recommended.

➢

Ground / thermal vias under the DUT are critical for the proper performance of this device.

The PCB shown herein utilizes copper filled vias (10 mils diameter) under the DUT to maximize heat transfer away from the DUT

under large signal conditions.

➢

Thermal dissipation is low for normal non-limiting operation.

Data Sheet Rev. B, October 2, 2018 | Subject to change without notice

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