Datasheet > TESVHA1C105M12R

TESVHA1C105M12R

更新时间： 2024-01-08 22:18:47

品牌	Logo	应用领域
日电电子 - NEC		电容器
页数	文件大小	规格书
3页	51K
描述
CAPACITOR, TANTALUM, SOLID, POLARIZED, 16V, 1uF, SURFACE MOUNT, 1206, CHIP

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TESVHA1C105M12R 技术参数

生命周期：	Obsolete	包装说明：	, 1206
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8532.21.00.50	风险等级：	5.82
电容：	1 µF	电容器类型：	TANTALUM CAPACITOR
介电材料：	TANTALUM (DRY/SOLID)	漏电流：	0.0005 mA
安装特点：	SURFACE MOUNT	负容差：	20%
端子数量：	2	最高工作温度：	125 °C
最低工作温度：	-55 °C	封装形状：	RECTANGULAR PACKAGE
包装方法：	TR	极性：	POLARIZED
正容差：	20%	额定（直流）电压（URdc）：	16 V
尺寸代码：	1206	表面贴装：	YES
Delta切线：	0.04	端子形状：	J BEND

TESVHA1C105M12R 数据手册

SV/H Series

S V /H S e r ie s T a n t a lu m C h ip C a p a c it o r s

( H ig h e r P e r f o r m a n c e )

DIMENSIONS [mm]

PERFORMANCE CHARACTERISTICS

Operating temperature range

−55 to +125°C with proper voltage

derating as shown in the following table.

DC working voltage and surge voltage

Rated voltage

10 16 20 25 35

at 85°C 10 16 20 25 35

at 125°C 6.3 10 13 16 22

at 85°C 13 20 26 33 46

Working

Surge

[A cases]

[B2 cases]

[C, D2 cases]

(Unit: mm)

Capacitance (at 20°C, 120 Hz)

Case

Code

Range:

Tolerance:

0.47 µF to 33 µF

±20%, ±10%

EIA code

3216

3528

6032

5846

3.2 ± 0.2 1.6 ± 0.2 1.2 ± 0.1 1.6 ± 0.2 0.8 ± 0.2

3.5 ± 0.2 2.8 ± 0.2 2.3 ± 0.1 1.9 ± 0.2 0.8 ± 0.2

6.0 ± 0.2 3.2 ± 0.2 2.2 ± 0.1 2.5 ± 0.2 1.3 ± 0.2

5.8 ± 0.2 4.6 ± 0.2 2.4 ± 0.1 3.2 ± 0.2 1.3 ± 0.2

−

Capacitance change with temperature

Not to exceed −12% at −55°C, +12%

at 85°C, and +15% at 125°C

0.4 C

−

Tangent of loss angle (at 20°C, 120 Hz)

0.47 µF to 4.7 µF: less than 0.04

6.8 µF to 33 µF: less than 0.06

DC rated

voltage

(

)

Vdc

µF

DC leakage current (at 20°C)

0.47

0.68

0.01 C V^NoteµA or 0.5 µA, whichever is greater

•

Damp heat (85% RH at 85°C, 56 days (1344 h))

Capacitance change: ±10%

Tangent of loss angle: 150% of

initial requirements

1.5

2.2

3.3

4.7

6.8

DC leakage current:

initial requirements

Endurance (at 85°C, DC rated voltage, 2000 h)

Capacitance change: ±10%

Tangent of loss angle: initial requirements

DC leakage current:

125% of

initial requirements

Resistance to soldering heat

(solder reflow and solder dip at 260°C, 10 s.)

Capacitance change: ± 5%

Tangent of loss angle: initial requirements

DC leakage current:

initial requirements

Rapid change of temperature (at −55 to 125°C,

1000 cycles)

Capacitance change: ± 10%

Leakage current:

initial requirements

Tangent of loss angleL initial requirements

Note: Product of capacitance in µF and voltage in V.

See pages 25 and 26 for taping specifications.

EC0171EJUV0SG00

12 3

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