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TDA6402A PDF预览

TDA6402A

更新时间: 2024-02-02 05:54:00
品牌 Logo 应用领域
恩智浦 - NXP 振荡器录像机电视有线电视
页数 文件大小 规格书
40页 198K
描述
5 V mixers/oscillators and synthesizers for cable TV and VCR 2-band tuners

TDA6402A 技术参数

生命周期:Obsolete零件包装代码:SSOP
包装说明:SSOP,针数:28
Reach Compliance Code:unknown风险等级:5.82
商用集成电路类型:VIDEO TUNERJESD-30 代码:R-PDSO-G28
长度:10.2 mm功能数量:1
端子数量:28最高工作温度:85 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:SSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH认证状态:Not Qualified
座面最大高度:2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V表面贴装:YES
温度等级:OTHER端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:5.3 mmBase Number Matches:1

TDA6402A 数据手册

 浏览型号TDA6402A的Datasheet PDF文件第33页浏览型号TDA6402A的Datasheet PDF文件第34页浏览型号TDA6402A的Datasheet PDF文件第35页浏览型号TDA6402A的Datasheet PDF文件第37页浏览型号TDA6402A的Datasheet PDF文件第38页浏览型号TDA6402A的Datasheet PDF文件第39页 
Philips Semiconductors  
Product specification  
5 V mixers/oscillators and synthesizers for  
cable TV and VCR 2-band tuners  
TDA6402; TDA6402A;  
TDA6403; TDA6403A  
Suitability of surface mount IC packages for wave and reflow soldering methods  
SOLDERING METHOD  
WAVE  
REFLOW(1)  
not suitable suitable  
PACKAGE  
BGA, LFBGA, SQFP, TFBGA  
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS  
PLCC(3), SO, SOJ  
not suitable(2)  
suitable  
suitable  
suitable  
LQFP, QFP, TQFP  
not recommended(3)(4) suitable  
not recommended(5)  
suitable  
SSOP, TSSOP, VSO  
Notes  
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum  
temperature (with respect to time) and body size of the package, there is a risk that internal or external package  
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the  
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.  
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink  
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).  
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.  
The package footprint must incorporate solder thieves downstream and at the side corners.  
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;  
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.  
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is  
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.  
2000 Jan 24  
36  

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