Datasheet > TC74AC367P_07

TC74AC367P_07

更新时间： 2024-09-28 05:04:11

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
9页	268K
描述
CMOS Digital Integrated Circuit Silicon Monolithic Hex Bus Buffer (3-state)

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中文翻译

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数据手册

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TC74AC367P_07 数据手册

TC74AC367P/F/FN/FT

TOSHIBA CMOS Digital Integrated Circuit Silicon Monolithic

TC74AC367P,TC74AC367F,TC74AC367FN,TC74AC367FT

Hex Bus Buffer (3-state)

Note: xxxFN (JEDEC SOP) is not available in

Japan.

The TC74AC367 is an advanced high speed CMOS HEX BUS

BUFFERs fabricated with silicon gate and double-layer metal

wiring C²MOS technology.

It achieves the high speed operation similar to equivalent

Bipolar Schottky TTL while maintaining the CMOS low power

dissipation.

It contains six buffers; four buffers are controlled by an enable

input ( G1 ), and the other two buffers are controlled by another

enable input ( G2 ). The outputs of each buffer group are enabled

when G1 and/or G2 inputs are held low; if held high, these

outputs are in a high impedance state.

TC74AC367P

TC74AC367F

TC74AC367FN

TC74AC367FT

Weight

All inputs are equipped with protection circuits against static

discharge or transient excess voltage.

Features

•

High speed: t = 3.7 ns (typ.) at V

= 5 V

Low power dissipation: I

= 8 μA (max) at Ta = 25°C

High noise immunity: V

= V

= 28% V

(min)

NIH

NIL

Symmetrical output impedance: |I | = I

= 24 mA (min)

Capability of driving 50 Ω

transmission lines.

∼

−

pHL

•

Balanced propagation delays: t

pLH

Wide operating voltage range: V

= 2 to 5.5 V

CC (opr)

Pin and function compatible with 74F367

DIP16-P-300-2.54A

SOP16-P-300-1.27A

SOL16-P-150-1.27

: 1.00 g (typ.)

: 0.18 g (typ.)

: 0.13 g (typ.)

: 0.06 g (typ.)

TSSOP16-P-0044-0.65A

2007-10-01

12 3 4 5 6 7...9

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与TC74AC367P_07相关器件

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