是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Transferred | 零件包装代码: | WAFER |
包装说明: | WAFER | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | HTS代码: | 8541.10.00.40 |
风险等级: | 5.76 | 应用: | GENERAL PURPOSE |
配置: | SINGLE | 二极管元件材料: | SILICON |
二极管类型: | RECTIFIER DIODE | JESD-30 代码: | X-XUUC-N |
JESD-609代码: | e3 | 最大非重复峰值正向电流: | 700 A |
元件数量: | 1 | 相数: | 1 |
最大输出电流: | 60 A | 封装主体材料: | UNSPECIFIED |
封装形状: | UNSPECIFIED | 封装形式: | UNCASED CHIP |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
最大重复峰值反向电压: | 100 V | 表面贴装: | YES |
技术: | SCHOTTKY | 端子面层: | MATTE TIN |
端子形式: | NO LEAD | 端子位置: | UPPER |
处于峰值回流温度下的最长时间: | 35 | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
T-DWS34 | IXYS |
获取价格 |
Rectifier Diode, Schottky, 1 Phase, 1 Element, 60A, 45V V(RRM), Silicon, WAFER | |
T-DWS4 | IXYS |
获取价格 |
Rectifier Diode, Schottky, 1 Phase, 1 Element, 10A, 45V V(RRM), Silicon, WAFER | |
TDX1209B-SAW-Diplexer | MICROCHIP |
获取价格 |
Surface Acoustic Wave (SAW) devices are compact, cost competitive radio frequency (RF) sol | |
TDX1210A-SAW-Diplexer | MICROCHIP |
获取价格 |
Surface Acoustic Wave (SAW) devices are compact, cost competitive radio frequency (RF) sol | |
TDX1210-SAW-Diplexer | MICROCHIP |
获取价格 |
Surface Acoustic Wave (SAW) devices are compact, cost competitive radio frequency (RF) sol | |
TDX1227-SAW-Diplexer | MICROCHIP |
获取价格 |
Surface Acoustic Wave (SAW) devices are compact, cost competitive radio frequency (RF) sol | |
TDXLF-308 | LGE |
获取价格 |
Tuning Fork Crystal Units | |
TDZ03009010KVP120PF+/-5%R16 | VISHAY |
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CAPACITOR, CERAMIC, 0.00012 uF, STUD MOUNT | |
TDZ045124 | VISHAY |
获取价格 |
Pot Capacitors with R 16 High Q Ceramic | |
TDZ050124 | VISHAY |
获取价格 |
Pot Capacitors with R 16 High Q Ceramic |