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SZ1SMA5914BT3G PDF预览

SZ1SMA5914BT3G

更新时间: 2024-09-29 11:01:39
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管齐纳二极管
页数 文件大小 规格书
5页 68K
描述
1.5 W Zener Diode Voltage Regulator

SZ1SMA5914BT3G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-C2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.76配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
JESD-30 代码:R-PDSO-C2元件数量:1
端子数量:2最高工作温度:150 °C
最低工作温度:-65 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性:UNIDIRECTIONAL
最大功率耗散:0.5 W参考标准:AEC-Q101
标称参考电压:3.6 V表面贴装:YES
技术:ZENER端子形式:C BEND
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:5%工作测试电流:104.2 mA
Base Number Matches:1

SZ1SMA5914BT3G 数据手册

 浏览型号SZ1SMA5914BT3G的Datasheet PDF文件第2页浏览型号SZ1SMA5914BT3G的Datasheet PDF文件第3页浏览型号SZ1SMA5914BT3G的Datasheet PDF文件第4页浏览型号SZ1SMA5914BT3G的Datasheet PDF文件第5页 
1SMA5913BT3 Series  
1.5 Watt Plastic  
Surface Mount  
Zener Voltage Regulators  
This complete new line of 1.5 Watt Zener Diodes offers the  
following advantages.  
http://onsemi.com  
Features  
Standard Zener Breakdown Voltage Range − 3.3 V to 68 V  
ESD Rating of Class 3 (>16 kV) per Human Body Model  
Flat Handling Surface for Accurate Placement  
Package Design for Top Slide or Bottom Circuit Board Mounting  
Low Profile Package  
CATHODE  
ANODE  
Ideal Replacement for MELF Packages  
Pb−Free Packages are Available  
Mechanical Characteristics:  
SMA  
CASE 403D  
PLASTIC  
CASE: Void-free, transfer-molded plastic  
FINISH: All external surfaces are corrosion resistant with readily  
solderable leads  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 seconds  
POLARITY: Cathode indicated by molded polarity notch or cathode  
band  
MARKING DIAGRAM  
FLAMMABILITY RATING: UL 94 V−0 @ 0.125 in  
8xxB  
AYWWG  
MAXIMUM RATINGS  
Rating  
Symbol Value  
Unit  
DC Power Dissipation @ T = 75°C,  
P
1.5  
20  
W
mW/°C  
L
D
Measured Zero Lead Length (Note 1)  
Derate above 75°C  
8xxB = Device Code (Refer to page 2)  
A
Y
= Assembly Location  
= Year  
Thermal Resistance, Junction−to−Lead  
R
q
50  
°C/W  
JL  
DC Power Dissipation @ T = 25°C (Note 2)  
P
0.5  
4.0  
250  
W
mW/°C  
°C/W  
A
D
WW  
G
= Work Week  
= Pb−Free Package  
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
Operating and Storage Temperature Range  
T , T  
−65 to  
+150  
°C  
J
stg  
ORDERING INFORMATION  
Device  
Package  
Shipping  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. 1 in square copper pad, FR−4 board.  
1SMA59xxBT3  
1SMA59xxBT3G  
SMA  
5000/Tape & Reel  
5000/Tape & Reel  
SMA  
(Pb−Free)  
2. FR−4 Board, using ON Semiconductor minimum recommended footprint.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
March, 2007 − Rev. 6  
1SMA5913BT3/D  
 

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