品牌 | Logo | 应用领域 |
意法半导体 - STMICROELECTRONICS | / | |
页数 | 文件大小 | 规格书 |
73页 | 1734K | |
描述 | ||
ARM7TDMI-S, 32-bit MCU with Flash, SMI, 3 std 16-bit timers PWM timer, fast 10-bit ADC, I2C, UART, SSP, USB and CAN |
是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | QFP | 包装说明: | 10 X 10 MM, ROHS COMPLIANT, LQFP-64 |
针数: | 64 | Reach Compliance Code: | compliant |
ECCN代码: | 3A991.A.2 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.8 | 具有ADC: | YES |
其他特性: | ALSO OPERATES AT 3V MINIMUM SUPPLY | 地址总线宽度: | |
位大小: | 32 | CPU系列: | ARM7 |
最大时钟频率: | 60 MHz | DAC 通道: | NO |
DMA 通道: | YES | 外部数据总线宽度: | |
JESD-30 代码: | S-PQFP-G64 | JESD-609代码: | e4 |
长度: | 10 mm | 湿度敏感等级: | 3 |
I/O 线路数量: | 38 | 端子数量: | 64 |
片上程序ROM宽度: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | PWM 通道: | YES |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | LFQFP |
封装等效代码: | QFP64,.47SQ,20 | 封装形状: | SQUARE |
封装形式: | FLATPACK, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3/5 V | 认证状态: | Not Qualified |
RAM(字节): | 16384 | ROM(单词): | 65536 |
ROM可编程性: | FLASH | 座面最大高度: | 1.6 mm |
速度: | 48 MHz | 子类别: | Microcontrollers |
最大供电电压: | 5.5 V | 最小供电电压: | 4.5 V |
标称供电电压: | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 10 mm |
uPs/uCs/外围集成电路类型: | MICROCONTROLLER, RISC |
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