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STM32F103RDY6TR

更新时间： 2024-02-02 04:53:32
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存微控制器和处理器外围集成电路装置通信时钟
页数 文件大小 规格书
123页 1691K
描述
High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces

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STM32F103RDY6TR 技术参数

是否Rohs认证： 符合生命周期：Active
零件包装代码：BGA包装说明：VFBGA, BGA64,8X8,20
针数：64Reach Compliance Code：compliant
HTS代码：8542.31.00.01风险等级：5.36
具有ADC：YES地址总线宽度：
位大小：32边界扫描：YES
CPU系列：CORTEX-M3最大时钟频率：16 MHz
DAC 通道：YESDMA 通道：YES
外部数据总线宽度：格式：FIXED POINT
集成缓存：NOJESD-30 代码：R-PBGA-B64
长度：4.466 mm低功率模式：YES
DMA 通道数量：12外部中断装置数量：16
I/O 线路数量：51端子数量：64
片上程序ROM宽度：8最高工作温度：85 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：VFBGA
封装等效代码：BGA64,8X8,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH认证状态：Not Qualified
RAM（字节）：65536ROM（单词）：393216
ROM可编程性：FLASH座面最大高度：0.635 mm
速度：72 MHz最大压摆率：69 mA
最大供电电压：3.6 V最小供电电压：2 V
标称供电电压：3.3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM宽度：4.395 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISC

STM32F103RDY6TR 数据手册

 浏览型号STM32F103RDY6TR的Datasheet PDF文件第2页浏览型号STM32F103RDY6TR的Datasheet PDF文件第3页浏览型号STM32F103RDY6TR的Datasheet PDF文件第4页浏览型号STM32F103RDY6TR的Datasheet PDF文件第5页浏览型号STM32F103RDY6TR的Datasheet PDF文件第6页浏览型号STM32F103RDY6TR的Datasheet PDF文件第7页 
STM32F103xC STM32F103xD  
STM32F103xE  
High-density performance line ARM-based 32-bit MCU with 256 to  
512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces  
Features  
FBGA  
■ Core: ARM 32-bit Cortex™-M3 CPU  
WLCSP64  
LQFP64 10 × 10 mm,  
– 72 MHz maximum frequency,  
LFBGA100 10 × 10 mm  
LQFP100 14 × 14 mm,  
LFBGA144 10 × 10 mm  
1.25 DMIPS/MHz (Dhrystone 2.1)  
LQFP144 20 × 20 mm  
performance at 0 wait state memory  
access  
■ Up to 112 fast I/O ports  
– 51/80/112 I/Os, all mappable on 16  
external interrupt vectors and almost all  
5 V-tolerant  
– Single-cycle multiplication and hardware  
division  
■ Memories  
■ Up to 11 timers  
– 256 to 512 Kbytes of Flash memory  
– up to 64 Kbytes of SRAM  
– Flexible static memory controller with 4  
Chip Select. Supports Compact Flash,  
SRAM, PSRAM, NOR and NAND memories  
– Up to four 16-bit timers, each with up to 4  
IC/OC/PWM or pulse counter and  
quadrature (incremental) encoder input  
– 2 × 16-bit motor control PWM timers with  
dead-time generation and emergency stop  
– LCD parallel interface, 8080/6800 modes  
– 2 × watchdog timers (Independent and  
Window)  
■ Clock, reset and supply management  
– 2.0 to 3.6 V application supply and I/Os  
– POR, PDR, and programmable voltage  
detector (PVD)  
– SysTick timer: a 24-bit downcounter  
– 2 × 16-bit basic timers to drive the DAC  
■ Up to 13 communication interfaces  
2
– 4-to-16 MHz crystal oscillator  
– Up to 2 × I C interfaces (SMBus/PMBus)  
– Internal 8 MHz factory-trimmed RC  
– Internal 40 kHz RC with calibration  
– 32 kHz oscillator for RTC with calibration  
– Up to 5 USARTs (ISO 7816 interface, LIN,  
IrDA capability, modem control)  
– Up to 3 SPIs (18 Mbit/s), 2 with I S  
interface multiplexed  
– CAN interface (2.0B Active)  
– USB 2.0 full speed interface  
– SDIO interface  
2
■ Low power  
– Sleep, Stop and Standby modes  
– V  
supply for RTC and backup registers  
BAT  
■ 3 × 12-bit, 1 µs A/D converters (up to 21  
■ CRC calculation unit, 96-bit unique ID  
channels)  
®
■ ECOPACK packages  
– Conversion range: 0 to 3.6 V  
– Triple-sample and hold capability  
– Temperature sensor  
Table 1.  
Device summary  
Part number  
Reference  
■ 2 × 12-bit D/A converters  
STM32F103RC STM32F103VC  
STM32F103ZC  
■ DMA: 12-channel DMA controller  
STM32F103xC  
STM32F103xD  
STM32F103xE  
– Supported peripherals: timers, ADCs, DAC,  
2
2
SDIO, I Ss, SPIs, I Cs and USARTs  
STM32F103RD STM32F103VD  
STM32F103ZD  
■ Debug mode  
STM32F103RE STM32F103ZE  
STM32F103VE  
– Serial wire debug (SWD) & JTAG interfaces  
– Cortex-M3 Embedded Trace Macrocell™  
September 2009  
Doc ID 14611 Rev 7  
1/123  
www.st.com  
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