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STM32F103C8U6XXX

更新时间: 2024-01-13 09:08:54
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 闪存通信
页数 文件大小 规格书
92页 1212K
描述
Medium-density performance line ARM-based 32-bit MCU with 64 or 128 KB Flash, USB, CAN, 7 timers, 2 ADCs, 9 communication interfaces

STM32F103C8U6XXX 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.84
具有ADC:YES地址总线宽度:
位大小:32CPU系列:CORTEX-M3
最大时钟频率:8 MHzDMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PQCC-N48
长度:7 mmI/O 线路数量:37
端子数量:48片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:QCCN封装等效代码:LCC48,.27SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER
电源:2.5/3.3 V认证状态:Not Qualified
RAM(字节):20480ROM(单词):65536
ROM可编程性:FLASH速度:72 MHz
子类别:Microcontrollers最大压摆率:50 mA
最大供电电压:3.6 V最小供电电压:2 V
标称供电电压:2.7 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:7 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC

STM32F103C8U6XXX 数据手册

 浏览型号STM32F103C8U6XXX的Datasheet PDF文件第4页浏览型号STM32F103C8U6XXX的Datasheet PDF文件第5页浏览型号STM32F103C8U6XXX的Datasheet PDF文件第6页浏览型号STM32F103C8U6XXX的Datasheet PDF文件第8页浏览型号STM32F103C8U6XXX的Datasheet PDF文件第9页浏览型号STM32F103C8U6XXX的Datasheet PDF文件第10页 
STM32F103x8, STM32F103xB  
List of figures  
List of figures  
Figure 1.  
Figure 2.  
Figure 3.  
Figure 4.  
Figure 5.  
Figure 6.  
Figure 7.  
Figure 8.  
Figure 9.  
STM32F103xx performance line block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19  
Clock tree . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
STM32F103xx performance line LFBGA100 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
STM32F103xx performance line LQFP100 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
STM32F103xx performance line LQFP64 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
STM32F103xx performance line TFBGA64 ballout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
STM32F103xx performance line LQFP48 pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
STM32F103xx Performance Line VFQFPN36 pinout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25  
Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31  
Figure 10. Pin loading conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Figure 11. Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Figure 12. Power supply scheme. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
Figure 13. Current consumption measurement scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34  
Figure 14. Typical current consumption in Run mode versus frequency (at 3.6 V) -  
code with data processing running from RAM, peripherals enabled. . . . . . . . . . . . . . . . . . 40  
Figure 15. Typical current consumption in Run mode versus frequency (at 3.6 V) -  
code with data processing running from RAM, peripherals disabled . . . . . . . . . . . . . . . . . 40  
Figure 16. Typical current consumption on V  
with RTC on versus temperature at different  
BAT  
V
values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42  
BAT  
Figure 17. Typical current consumption in Stop mode with regulator in Run mode versus  
temperature at V = 3.3 V and 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
DD  
Figure 18. Typical current consumption in Stop mode with regulator in Low-power mode versus  
temperature at V = 3.3 V and 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43  
DD  
Figure 19. Typical current consumption in Standby mode versus temperature at  
V
= 3.3 V and 3.6 V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44  
DD  
Figure 20. High-speed external clock source AC timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
Figure 21. Low-speed external clock source AC timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49  
Figure 22. Typical application with an 8 MHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50  
Figure 23. Typical application with a 32.768 kHz crystal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51  
Figure 24. I/O AC characteristics definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60  
Figure 25. Recommended NRST pin protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61  
2
Figure 26. I C bus AC waveforms and measurement circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63  
Figure 27. SPI timing diagram - slave mode and CPHA = 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65  
(1)  
Figure 28. SPI timing diagram - slave mode and CPHA = 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65  
(1)  
Figure 29. SPI timing diagram - master mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66  
Figure 30. USB timings: definition of data signal rise and fall time . . . . . . . . . . . . . . . . . . . . . . . . . . . 67  
Figure 31. ADC accuracy characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
Figure 32. Typical connection diagram using the ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71  
Figure 33. Power supply and reference decoupling (V  
Figure 34. Power supply and reference decoupling (V  
Figure 35. VFQFPN36 6 x 6 mm, 0.5 mm pitch, package outline  
not connected to V  
). . . . . . . . . . . . . . 71  
). . . . . . . . . . . . . . . . . 72  
REF+  
DDA  
connected to V  
REF+  
DDA  
(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74  
(1)(2)(3). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .74  
Figure 36. Recommended footprint (dimensions in mm)  
Figure 37. LFBGA100 - 10 x 10 mm low profile fine pitch ball grid array package  
outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75  
Figure 38. Recommended PCB design rules (0.80/0.75 mm pitch BGA) . . . . . . . . . . . . . . . . . . . . . . 76  
Figure 39. LQFP100, 14 x 14 mm 100-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . 77  
(1)  
Figure 40. Recommended footprint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77  
Figure 41. LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . 78  
Doc ID 13587 Rev 11  
7/92  

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