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STLS2F02-LP PDF预览

STLS2F02-LP

更新时间: 2024-09-28 19:55:27
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS 外围集成电路
页数 文件大小 规格书
49页 706K
描述
MICROPROCESSOR, PBGA452, 27 X 27 MM, 2.90 MM HEIGHT, ROHS COMPLIANT, HFCBGA-452

STLS2F02-LP 技术参数

生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 2.90 MM HEIGHT, ROHS COMPLIANT, HFCBGA-452针数:452
Reach Compliance Code:compliant风险等级:5.84
位大小:64JESD-30 代码:S-PBGA-B452
端子数量:452最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA452,26X26,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.26,1.8,3.3 V认证状态:Not Qualified
速度:800 MHz子类别:Microprocessors
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
uPs/uCs/外围集成电路类型:MICROPROCESSORBase Number Matches:1

STLS2F02-LP 数据手册

 浏览型号STLS2F02-LP的Datasheet PDF文件第2页浏览型号STLS2F02-LP的Datasheet PDF文件第3页浏览型号STLS2F02-LP的Datasheet PDF文件第4页浏览型号STLS2F02-LP的Datasheet PDF文件第5页浏览型号STLS2F02-LP的Datasheet PDF文件第6页浏览型号STLS2F02-LP的Datasheet PDF文件第7页 
STLS2F02-LP  
Loongson 2F  
high performance 64-bit superscalar MIPS® microprocessor  
Preliminary Data  
Features  
64-bit superscalar architecture  
800 MHz clock frequency  
Single/double precision floating-point units  
New streaming multimedia instruction set  
support (SIMD)  
64 Kbyte instruction cache, 64 Kbyte data  
HFCBGA452 (27x27x2.9mm)  
cache, on-chip 512 Kbyte unified L2 cache  
On chip DDR2-667 and PCI-X controller  
The memory hierarchy is composed by the first  
level of 64 Kbyte 4-way set associative caches for  
instructions and data, the second level of  
512 Kbyte unified 4-way set associative cache  
and the memory management unit with table  
lookside buffer.  
2.9 W @ 800 MHz power consumption:  
– Best in class for power management  
– Voltage/frequency scaling  
– Standby mode support  
– L2 cache disable/enable option  
The Loongson microprocessor family is the  
outcome of a successful collaboration started in  
2004 between STMicroelectronics and the  
Institute of Computing Technology, part of the  
Chinese Academy of Science. Loongson  
microprocessors were co-developed by  
STMicroelectronics and the Institute of  
Computing Technology to address all the  
applications requiring high level of performance  
and low power dissipation.  
Leading edge 90 nm process technology  
27x27 heat spreader flip-chip BGA package  
MIPS based (compatible with MIPSIII)  
instruction set  
Description  
The STLS2F02-LP is a MIPS based 64-bit  
superscalar microprocessor, able to issue four  
instructions per clock cycle among six functional  
units: two integer, two single/double-precision  
floating-point, one 64-bit SIMD and one load/store  
unit.  
Compared to the STLS2E02 processor, the  
STLS2F02-LP has an enhanced architecture  
providing higher performances, reduced power  
consumption, integrated DDR2 memory controller  
and PCI-X bus interface.  
The micro architecture is organized with nine  
stages of pipeline and support of dynamic branch  
prediction.  
Table 1.  
Device summary  
Order code  
Package  
HFCBGA452 (27x27x2.9 mm)  
Packing  
STLS2F02-LP  
Tray  
January 2009  
Rev 1  
1/49  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
1

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