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SST39CF800A PDF预览

SST39CF800A

更新时间: 2024-01-22 16:59:25
品牌 Logo 应用领域
SST /
页数 文件大小 规格书
30页 341K
描述
2 MBIT / 4 MBIT / 8 MBIT ( X 16 ) MULTI - PURPOSE FLASH

SST39CF800A 数据手册

 浏览型号SST39CF800A的Datasheet PDF文件第2页浏览型号SST39CF800A的Datasheet PDF文件第3页浏览型号SST39CF800A的Datasheet PDF文件第4页浏览型号SST39CF800A的Datasheet PDF文件第5页浏览型号SST39CF800A的Datasheet PDF文件第6页浏览型号SST39CF800A的Datasheet PDF文件第7页 
2 Mbit / 4 Mbit / 8 Mbit (x16) Multi-Purpose Flash  
SST39LF200A / SST39LF400A / SST39LF800A  
SST39VF200A / SST39VF400A / SST39VF800A  
SST39LF/VF200A / 400A / 800A3.0 & 2.7V 2Mb / 4Mb / 8Mb (x16) MPF memories  
Data Sheet  
FEATURES:  
Organized as 128K x16 / 256K x16 / 512K x16  
Single Voltage Read and Write Operations  
Fast Erase and Word-Program  
Sector-Erase Time: 18 ms (typical)  
Block-Erase Time: 18 ms (typical)  
Chip-Erase Time: 70 ms (typical)  
Word-Program Time: 14 µs (typical)  
Chip Rewrite Time:  
– 3.0-3.6V for SST39LF200A/400A/800A  
– 2.7-3.6V for SST39VF200A/400A/800A  
Superior Reliability  
Endurance: 100,000 Cycles (typical)  
Greater than 100 years Data Retention  
2 seconds (typical) for SST39LF/VF200A  
4 seconds (typical) for SST39LF/VF400A  
8 seconds (typical) for SST39LF/VF800A  
Low Power Consumption  
Automatic Write Timing  
Internal VPP Generation  
End-of-Write Detection  
Active Current: 20 mA (typical)  
Standby Current: 3 µA (typical)  
Sector-Erase Capability  
Uniform 2 KWord sectors  
Block-Erase Capability  
Uniform 32 KWord blocks  
Fast Read Access Time  
Toggle Bit  
Data# Polling  
CMOS I/O Compatibility  
JEDEC Standard  
Flash EEPROM Pinouts and command sets  
Packages Available  
45 and 55 ns for SST39LF200A/400A  
55 ns for SST39LF800A  
70 and 90 ns for SST39VF200A/400A/800A  
48-lead TSOP (12mm x 20mm)  
48-ball TFBGA (6mm x 8mm)  
Latched Address and Data  
PRODUCT DESCRIPTION  
The SST39LF200A/400A/800A and SST39VF200A/400A/  
800A devices are 128K x16 / 256K x16 / 512K x16 CMOS  
Multi-Purpose Flash (MPF) manufactured with SSTs pro-  
prietary, high performance CMOS SuperFlash technology.  
The split-gate cell design and thick oxide tunneling injector  
attain better reliability and manufacturability compared with  
alternate approaches. The SST39LF200A/400A/800A  
write (Program or Erase) with a 3.0-3.6V power supply. The  
SST39VF200A/400A/800A write (Program or Erase) with a  
2.7-3.6V power supply. These devices conform to JEDEC  
standard pinouts for x16 memories.  
cantly improve performance and reliability, while lowering  
power consumption. They inherently use less energy dur-  
ing Erase and Program than alternative flash technologies.  
When programming a flash device, the total energy con-  
sumed is a function of the applied voltage, current, and  
time of application. Since for any given voltage range, the  
SuperFlash technology uses less current to program and  
has a shorter erase time, the total energy consumed during  
any Erase or Program operation is less than alternative  
flash technologies. These devices also improve flexibility  
while lowering the cost for program, data, and configuration  
storage applications.  
Featuring high performance Word-Program, the  
SST39LF200A/400A/800A and SST39VF200A/400A/  
800A devices provide a typical Word-Program time of 14  
µsec. The devices use Toggle Bit or Data# Polling to detect  
the completion of the Program or Erase operation. To pro-  
tect against inadvertent write, they have on-chip hardware  
and software data protection schemes. Designed, manu-  
factured, and tested for a wide spectrum of applications,  
these devices are offered with a guaranteed endurance of  
10,000 cycles. Data retention is rated at greater than 100  
years.  
The SuperFlash technology provides fixed Erase and Pro-  
gram times, independent of the number of Erase/Program  
cycles that have occurred. Therefore the system software  
or hardware does not have to be modified or de-rated as is  
necessary with alternative flash technologies, whose Erase  
and Program times increase with accumulated Erase/Pro-  
gram cycles.  
To meet surface mount requirements, the SST39LF200A/  
400A/800A and SST39VF200A/400A/800A are offered in  
both 48-lead TSOP packages and 48-ball TFBGA pack-  
ages. See Figures 1 and 2 for pinouts.  
The SST39LF200A/400A/800A and SST39VF200A/400A/  
800A devices are suited for applications that require conve-  
nient and economical updating of program, configuration,  
or data memory. For all system applications, they signifi-  
©2001 Silicon Storage Technology, Inc.  
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.  
MPF is a trademark of Silicon Storage Technology, Inc.  
S71117-04-000 6/01  
1
360  
These specifications are subject to change without notice.  

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