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SS2625Q1-6 PDF预览

SS2625Q1-6

更新时间: 2024-02-21 04:45:46
品牌 Logo 应用领域
铁电 - RAMTRON 静态存储器内存集成电路
页数 文件大小 规格书
30页 223K
描述
ZBT SRAM, 2MX36, 3.5ns, CMOS, PQFP100, TQFP-100

SS2625Q1-6 技术参数

生命周期:Obsolete零件包装代码:QFP
包装说明:QFP,针数:100
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.84
最长访问时间:3.5 nsJESD-30 代码:R-PQFP-G100
内存密度:75497472 bit内存集成电路类型:ZBT SRAM
内存宽度:36功能数量:1
端子数量:100字数:2097152 words
字数代码:2000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX36封装主体材料:PLASTIC/EPOXY
封装代码:QFP封装形状:RECTANGULAR
封装形式:FLATPACK并行/串行:PARALLEL
认证状态:Not Qualified最大供电电压 (Vsup):2.625 V
最小供电电压 (Vsup):2.375 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子位置:QUADBase Number Matches:1

SS2625Q1-6 数据手册

 浏览型号SS2625Q1-6的Datasheet PDF文件第2页浏览型号SS2625Q1-6的Datasheet PDF文件第3页浏览型号SS2625Q1-6的Datasheet PDF文件第4页浏览型号SS2625Q1-6的Datasheet PDF文件第5页浏览型号SS2625Q1-6的Datasheet PDF文件第6页浏览型号SS2625Q1-6的Datasheet PDF文件第7页 
72Mbit Pipelined BSRAM  
w/ NoBL Architecture  
2Mx36  
Preliminary Data Sheet  
Description  
Features  
The Enhanced Memory Systems SS2625 is a 72-Mbit  
synchronous pipelined burst SRAM designed specifically to  
support back-to-back read/write operations without the  
insertion of wait states. The device is organized as 2Mx36  
and is offered in 3.3V and 2.5V versions. They are designed  
to transfer data on every clock cycle. This feature  
dramatically improves throughput, especially in systems that  
require frequent write/read transitions.  
High Density 72-Mbit  
166 MHz bus operations with zero wait states –  
Data is transferred on every clock  
Fully Registered for Pipelined Operation  
User Selectable Linear or Interleaved Burst Order  
Byte Write Capability  
Single 2.5V or 3.3V Power Supply  
Fast Clock to Output Times  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. All data outputs pass through  
output registers controlled by the rising edge of the clock.  
The clock input is qualified by the Clock Enable signal,  
which, when deasserted, suspends operation and extends the  
previous clock cycle. Maximum access delay from the rising  
edge of the clock is 3.5 ns (166 MHz device).  
3.5 ns (for 166 MHz device)  
4.2 ns (for 133 MHz device)  
5.0 ns (for 100 MHz device)  
Clock Enable pin to Suspend Operations  
Synchronous Self Timed Writes  
Asynchronous Output Enable  
JEDEC Standard 100-pin TQFP & 119-pin PBGA  
Low Standby Power  
JTAG 1149.1 Compliant Boundary Scan  
Write operations are controlled by the four Byte Write Select  
signals and a Read/Write signal. All writes are conducted  
with on-chip synchronous self-timed write circuitry.  
Three synchronous Chip Enable signals and an asynchronous  
Output Enable signal provide for easy depth expansion and  
output three-state control. To avoid bus contention, the output  
drivers are synchronously three-stated during the data portion  
of a write sequence.  
Block Diagram  
36  
CLK  
Data-In  
Reg.  
/CE  
LD#  
Addr  
CKE#  
CE1#  
CE2  
CE3#  
R/W#  
BW#(a:d)  
2Mx36  
CONTROL  
and WRITE  
LOGIC  
Memory  
Array  
36  
36  
DQ(a:d)  
G#  
This is a product in sampling or pre-production phase of development. Char-  
acteristic data and other specifications are subject to change without notice.  
Enhanced Memory Systems Inc., 1850 Ramtron Dr., Colo Spgs, CO 80921  
PHONE: (800) 545-DRAM; FAX: (719) 488-9095; http://www.edram.com  
Revision 1.0  
Page 1 of 30  

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