SMD0805 Series
Part number System
SMD0805 -XXX
Holding Current Rating
0805 Dimension Surface Mount Device
Our Mark
Test Procedures and Requirements
Test
Test Conditions
Accept/Reject Criteria
Resistance
In still air @ 25℃
Rmin ≤ R ≤ Rmax
Tmaximum Time to Trip
No trip
Time to Trip
Specified current,Vmax,25℃
30min ,at IH
Hold Current
Trip Cycle Life
Trip Endurance
Physical Characteristics
Terminal materials :
Soldering zone
Vmax,Imax,100cycles
Vmax,1hours
No arcing or burning
No arcing or burning
Tin-Plated Nickle-copper
Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Environmental Specifications
Test
Conditions
Resistance change
Passive aging
Humidity aging
Thermal shock
Solvent Resistance
Vibration
+85℃,1000hours
±10%
±5%
+85℃/85%R.H.1000hours
MIL-STD-202,Method 107G ,+85℃/-40℃,20times -30% typical resistance change
MIL-STD-202,Method 215
No change
No change
ML-STD-883C,Test Condition A
Recommended Pad layout(mm)
Specifications are subject to change without notice
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