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SL1466/KG/QP1S PDF预览

SL1466/KG/QP1S

更新时间: 2024-02-17 11:19:38
品牌 Logo 应用领域
美高森美 - MICROSEMI 电信光电二极管电信集成电路
页数 文件大小 规格书
18页 341K
描述
Telecom Circuit, 1-Func, PDSO28, PLASTIC, DIP-28

SL1466/KG/QP1S 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOIC包装说明:,
针数:28Reach Compliance Code:unknown
HTS代码:8542.39.00.01风险等级:5.92
JESD-30 代码:R-PDSO-G28JESD-609代码:e0
功能数量:1端子数量:28
最高工作温度:80 °C最低工作温度:-20 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE认证状态:Not Qualified
标称供电电压:5 V表面贴装:YES
电信集成电路类型:TELECOM CIRCUIT温度等级:COMMERCIAL EXTENDED
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUALBase Number Matches:1

SL1466/KG/QP1S 数据手册

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