Datasheet > SFC2280-68.WCT

SFC2280-68.WCT

更新时间： 2024-01-06 16:15:26

品牌	Logo	应用领域
商升特 - SEMTECH		LTE
页数	文件大小	规格书
10页	269K
描述
Data Line Filter, 2 Function(s), 5V, 6 Pin(s), Plastic, LEAD FREE, FLIP CHIP-6

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SFC2280-68.WCT 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8504.50.80.00	风险等级：	5.84
电容：	30 µF	最大直流电阻：	75 Ω
滤波器类型：	DATA LINE FILTER	高度：	0.75 mm
JESD-609代码：	e4	长度：	1.47 mm
安装类型：	SURFACE MOUNT	功能数量：	2
端子数量：	6	最高工作温度：	125 °C
最低工作温度：	-55 °C	输出阻抗：	50 OHM Ω
包装材料：	PLASTIC	包装方法：	TAPE AND REEL
物理尺寸：	L1.47XB0.97XH0.75 (mm)	电源：	5
额定电压：	5 V	子类别：	Data Line Filters
端子面层：	Gold (Au)	宽度：	0.97 mm
Base Number Matches：	1

SFC2280-68.WCT 数据手册

SFC2280-68

ChipClamp^ΤΜ

Headset Microphone EMI and ESD Protection

PRELIMINARY

PROTECTION PRODUCTS

Features

Description

The SFC2280-68 is a low pass filter array with inte-

grated TVS diodes. It is designed to provide bidirec-

tional filtering of EMI/RFI signals and electrostatic

discharge (ESD) protection in portable electronic

Flip Chip bidirectional EMI/RFI filter with

integrated ESD protection

ESD protection to

IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact)

equipment. This state-of-the-art device utilizes solid-

state silicon-avalanche technology for superior clamp-

ing performance and DC electrical characteristics.

They have been optimized for use on a speaker port in

cellular phones and other protable electronics.

IEC 61000-4-4 (EFT) 40A (5/50ns)

Filter performance: 20dB attenuation at 800MHz

Small chip scale package requires less board space

Low profile (< 0.65mm)

Bidirectional TVS to support negative voltages in

audio applications

Maximum Dimensions: 1.5 x 1.0 x 0.65 mm

TVS Working voltage: 5V

Series Resistor: 68Ω

The device has very low insertion loss in the pass band

(to approximately 10MHz) and high attenuation at

frequencies ranging from 800MHz to 3GHz. Each line

features two stages of TVS diode protection. The TVS

diodes provide effective suppression of ESD voltages

in excess of ±15kV (air discharge) and ±8kV (contact

discharge) per IEC 61000-4-2, level 4. The TVS diodes

are bidirectional for supporting bipolar audio signals

without distortion.

Solid-state technology

Mechanical Characteristics

JEDEC MO-211, 0.50 mm Pitch Flip Chip Package

Non-conductive top side coating

Marking : Marking Code and orientation mark

Packaging : Tape and Reel

The SFC2280-68 is a 6-bump, 0.5mm pitch flip chip

array with a 3x2 bump grid. It measures 1.5 x 1.0 x

0.65mm. This small outline makes the device espe-

cially well suited for portable applications. The flip chip

design results in lower inductance for optimized filter

and ESD clamping performance.

Applications

Cell Phone Handsets and Accessories

Personal Digital Assistants (PDA’s)

Notebook and Hand Held Computers

Digital Camcorders

MP3 Players

Circuit Diagram (Each Line)

Schematic & PIN Configuration

LOW PASS FILTER

3 x 2 Grid CSP TVS (Bottom View)

www.semtech.com

Revision 08/04/04

12 3 4 5 6 7...10

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