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SCA-17 PDF预览

SCA-17

更新时间: 2024-02-03 02:15:49
品牌 Logo 应用领域
STANFORD 放大器射频微波
页数 文件大小 规格书
3页 257K
描述
DC-3 GHz, Cascadable GaAs HBT MMIC Amplifier

SCA-17 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:TO-243Reach Compliance Code:unknown
风险等级:5.92Is Samacsys:N
特性阻抗:50 Ω构造:COMPONENT
增益:18 dB最大输入功率 (CW):20 dBm
JESD-609代码:e0安装特点:SURFACE MOUNT
端子数量:3最大工作频率:3000 MHz
最小工作频率:最高工作温度:85 °C
最低工作温度:-45 °C封装主体材料:PLASTIC/EPOXY
封装等效代码:TO-243电源:4 V
射频/微波设备类型:WIDE BAND LOW POWER子类别:RF/Microwave Amplifiers
表面贴装:YES技术:GAAS
端子面层:Tin/Lead (Sn/Pb)最大电压驻波比:1.5
Base Number Matches:1

SCA-17 数据手册

 浏览型号SCA-17的Datasheet PDF文件第1页浏览型号SCA-17的Datasheet PDF文件第2页 
SCA-17 DC-3 GHz Cascadable MMIC Amplifier  
MTTF vs. Temperature  
@ Id = 40mA  
Absolute Maximum Ratings  
A b s o lu te  
P a ra m e te r  
M a x im u m  
Lead  
MTTF (hrs)  
Temperature  
D e v ice C u rre n t  
P o w e r D is s ip a tio n  
7 5 m A  
+85C  
+120C  
+150C  
1,000,000  
100,000  
10,000  
3 5 0 m W  
R F In p u t P o w e r  
1 0 0 m W  
J u n c tio n Te m p e ra tu re  
O p e ra tin g Te m p e ra tu re  
S to ra g e Te m p e ra tu re  
+ 2 0 0 C  
-4 5 C to + 8 5 C  
-6 5 C to + 1 5 0 C  
Thermal Resistance (Lead-Junction): 412° C/W  
Notes:  
1. Operation of this device above any one of these  
parameters may cause permanent damage.  
Recommended Bias Resistor Values  
Supply Voltage (Vs)  
Rbias (Ohms)  
5V  
25  
7.5V  
88  
9V  
12V  
200  
15V  
275  
20V  
400  
125  
Mounting Instructions  
The data shown was taken on a 31 mil thick FR-4 board with  
1 ounce of copper on both sides.  
Typical Biasing Configuration  
The board was mounted to a baseplate with 3 screws as shown.  
The screws bring the top side copper temperature to the same  
value as the baseplate.  
Pin Designation  
1. Use 1 or 2 ounce copper, if possible.  
2. Solder the copper pad on the backside of the device  
package to the ground plane.  
3. Use a large ground pad area with many plated through-holes  
as shown.  
1
2
3
4
RF in  
GND  
RF out and Bias  
GND  
4. If possible, use at least one screw no more than 0.2 inch  
from the device package to provide a low thermal resistance  
path to the baseplate of the package.  
5. Thermal resistance from ground lead to screws is  
2 deg. C/W.  
Outline Drawing  
1
2
4
3
SCA-17  
522 Almanor Ave., Sunnyvale, CA 94086  
Phone: (800) SMI-MMIC  
http://www.stanfordmicro.com  
5-155  

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