Datasheet > SA636BS,115

SA636BS,115

更新时间： 2024-02-24 22:23:16

品牌	Logo	应用领域
恩智浦 - NXP		电信电信集成电路
页数	文件大小	规格书
31页	2053K
描述
SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI QFN 20-Pin

阅读下载

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

SA636BS,115 技术参数

Source Url Status Check Date：	2013-06-14 00:00:00	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	QFN
包装说明：	HVQFN-20	针数：	20
Reach Compliance Code：	compliant	风险等级：	1.65
JESD-30 代码：	S-PQCC-N20	长度：	4 mm
湿度敏感等级：	1	功能数量：	1
端子数量：	20	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	PLASTIC/EPOXY
封装代码：	VQCCN	封装形状：	SQUARE
封装形式：	CHIP CARRIER, VERY THIN PROFILE	峰值回流温度（摄氏度）：	NOT SPECIFIED
座面最大高度：	1 mm	标称供电电压：	3 V
表面贴装：	YES	电信集成电路类型：	TELECOM CIRCUIT
温度等级：	INDUSTRIAL	端子形式：	NO LEAD
端子节距：	0.5 mm	端子位置：	QUAD
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	4 mm
Base Number Matches：	1

SA636BS,115 数据手册

SA636

NXP Semiconductors

Low voltage high performance mixer FM IF system

6.2 Pin description

Table 2.

Symbol

Pin description

Description

HVQFN20

SSOP20

RF_IN

RF input

RF_IN_DECOUPL

OSC_OUT

RF input decoupling pin

oscillator output (emitter)

oscillator input (base)

OSC_IN

V_CC

positive supply voltage

RSSI amplifier negative feedback terminal

RSSI output

RSSI_FEEDBACK

RSSI_OUT

POWER_DOWN_CTRL

DATA_OUT

power-down control; active HIGH

data output

QUADRATURE_IN

LIMITER_OUT

LIMITER_DECOUPL

LIMITER_IN

quadrature detector input terminal

limiter amplifier output

limiter amplifier decoupling pin

limiter amplifier input

13^[1]

DAP

GND

ground; negative supply

IF amplifier output

IF_AMP_OUT

IF_AMP_DECOUPL

IF_AMP_IN

IF amplifier decoupling pin

IF amplifier input

IF_AMP_DECOUPL

MIXER_OUT

IF amplifier decoupling pin

mixer output

exposed die attach paddle; connect to ground

[1] For the HVQFN20 package, the exposed die attach paddle must be connected to device ground pin 13 and

the PCB ground plane. GND pin must be connected to supply ground for proper device operation. For

enhanced thermal, electrical, and board level performance, the exposed pad needs to be soldered to the

board using a corresponding thermal pad on the board and for proper heat conduction through the board,

thermal vias need to be incorporated in the printed-circuit board in the thermal pad region.

SA636

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 7 — 16 June 2016

5 of 31

1 2 3 456 7 8...31

下载PDF

与SA636BS,115相关器件

型号	品牌	描述	获取价格	数据表
SA636DK	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK/01,112	NXP	SA636 - Low voltage high performance mixer FM IF system with high-speed RSSI SSOP2 20-Pin	获取价格
SA636DK/02J	NXP	Telecom Circuit	获取价格
SA636DK01	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK02	NXP	Low voltage high performance mixer FM IF system with high-speed RSSI	获取价格
SA636DK-T	NXP	IC SPECIALTY TELECOM CIRCUIT, PDSO20, 4.40 MM, PLASTIC, MO-152, SOT266-1, SSOP-20, Telecom	获取价格