Datasheet > S40032LK8LK8FC-75A

S40032LK8LK8FC-75A

更新时间： 2022-11-26 04:39:56

品牌	Logo	应用领域
其他 - ETC		动态存储器
页数	文件大小	规格书
9页	362K
描述
SYVCHRONOUS DRAM

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S40032LK8LK8FC-75A 数据手册

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128Mb: x4, x8, x16

SDRAM 3.3V

ICC OPERATING CONDITIONS AND MAXIMUM LIMITS: Vdd = 3.3V ± 10%V, Temp. = 25° to 70 °C

Supply Current

OPERATING CURRENT: ACTIVE mode, burst = 1, READ or WRITE, tRC > tRC

(MIN), one bank active, CL=3

Symbol

Icc1

-75A

165

-8A

140

Units

Notes

1, 2, 3, 4

STANDBY CURRENT: POWER-DOWN mode, CKE = LOW,

Standard parts

Idd2

no accesses in progress

Self refresh parts

Idd2

Icc3

Icc4

1, 2, 3, 4

STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks idle

STANDBY CURRENT: CS# = HIGH, CKE = HIGH, all banks active after tRCD met,

no accesses in progress.

OPERATING CURRENT: BURST mode after tRCD met, continuous burst, READ,

WRITE, all banks active, CL=3

Icc5

165

145

1, 2, 3, 4

AUTO REFRESH CURRENT tRC > tRC (MIN)

AUTO REFRESH CURRENT tRC=15.6us

SELF REFRESH CURRENT (Self refresh parts only, part M)

CL = 3

Icc6

Icc7

Idd8

265

245

1, 2, 3, 4

Notes

1. All voltages referenced to Vss.

2. An initial pause of 100 ms is required after power-up, followed by two AUTO REFRESH commands, before proper device operation

is ensure. (Vdd and VddQ must be powered-up simultaneously Vss and VssQ must be at the same potential.) The two AUTO

REFRESH command wake-ups should be repeated any time the ^tREF refresh requirement is exceeded.

3. Icc specifications are tested after the device is properly initialized. tCK= 10ns for –8 and tCK=7.5ns for –75A.

PDF: 09005aef807827f6 / Source: 09005aef807825bd

128Mb SDRAM

Rev: 11/29/2004

SpecTek reserves the right to change products or

specifications without notice. Ó 2001, 2002, 2004 SpecTek

www.spectek.com

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