Datasheet > S1206S1.25

S1206S1.25

更新时间： 2022-02-26 09:18:20

品牌	Logo	应用领域
固锝 - GOOD-ARK		/
页数	文件大小	规格书
4页	191K
描述
Chip Fuse

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数据手册

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S1206S1.25 数据手册

Chip Fuse

Description

S1206S Series

■

High inrush current withstanding capability

Compatible with reflow and wave solder

Rugged ceramic and glass construction

Excellent environmental performance

RoHS Compliant ,Lead Free & Halogen Free

material

OVERCOAT

Sn PLATING

Applications

■

Telecommunication: PDA / DSL

Computers: LCD Panel / Printers/ Laptop/

Servers

Cu / Ni PLATING

FUSE ELEMENT

CERAMIC SUBSTRATE

■

Consumer Electronics: DVD player / MP3

MP4 Player

Environmental Data

■

Life Test: MIL-STD-202, Method 108D

Humidity Bias: MIL-STD-202 , Method 103

Moisture Resistance Test: MIL-STD-202, Method 106G

Thermal Shock: MIL-STD-202, Method 107G

Terminal Strength: AEC-Q200-006

Board Flex: AEC-Q200-005 Appendix 2 Note: 1mm (Min)

Vibration: MIL-STD-202, Method 204C

Mechanical Shock:MIL-STD-202,Method 213C

Solderability: ANSI/J-STD-202

Resistance to Solder Heat: MIL-STD-202,Method 210B

Resistance to Solvents Test: MIL-STD-202, Method 215

Electrical Characteristics

Ampere Rating

1A-7A

% of Amp Rating

100%

Opening Time

4 Hours Minimum

1~120 Senconds

0.1~3 Senconds

1A-7A

200%

1A-7A

300%

1A-7A

800%

0.002～0.05 Seconds

Electrical Specifications

Voltage Interruptin Resistance

Typical

Melt I²t ***

(A²s)

Alpha

Product

Current

Rating

g Rating*

(ohms)**

Typ.

Code Marking

Code

Rating

S1206S1

63V

50A

0.42

0.10

@copyright Good-Ark2012

www.goodark.com

12 3 4

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