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S11962-01CR_15 PDF预览

S11962-01CR_15

更新时间: 2022-02-26 14:32:17
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HAMAMATSU /
页数 文件大小 规格书
10页 281K
描述
Distance area image sensor

S11962-01CR_15 数据手册

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Distance area image sensor  
S11962-01CR  
Measures the distance to an object by TOF  
(Time-Of-Flight) method  
The distance image sensors are designed to measure the distance to an object by TOF method. When used in combination  
with a pulse modulated light source, this sensor outputs phase difference information on the timing that the light is emitted  
and received. The sensor output signals are arithmetically processed by an external signal processing circuit or a PC to obtain  
distance data.  
Features  
Applications  
High-speed charge transfer structure  
Obstacle detection (self-driving, robots, etc.)  
Security (intrusion detection, etc.)  
Shape recognition (logistics, robots, etc.)  
Motion capture  
Operates with minimal detection errors even under uctuating  
(charge drain function)  
Real-time distance measurement  
Structure  
Parameter  
Specication  
2.56 × 2.56  
40 × 40  
40  
72 × 72  
64 × 64  
48-pin PWB  
AR-coated glass  
Unit  
mm  
μm  
μm  
pixels  
pixels  
-
Image size  
Pixel size  
Pixel pitch  
Number of pixels  
Number of effective pixels  
Package  
Window material  
-
Note: This product is not hermetically sealed.  
Absolute maximum ratings  
Parameter  
Analog supply voltage  
Digital supply voltage  
Pixel amplier  
Symbol  
Vdd(A)  
Vdd(D)  
Vsf  
Condition  
Ta=25 °C  
Ta=25 °C  
Value  
-0.3 to +6  
-0.3 to +6  
Unit  
V
V
Pixel reset  
Output offset  
Vr  
Vref  
Vpg  
reset  
vst  
Analog input terminal  
voltage  
Ta=25 °C  
-0.3 to Vdd(A) + 0.3  
V
V
Photosensitive area  
Frame reset pulse  
Frame synchronous trigger pulse  
Line synchronous trigger pulse  
Pixel reset pulse  
Digital input terminal  
voltage  
hst  
Ta=25 °C  
-0.3 to Vdd(D) + 0.3  
_
ext res  
Master clock pulse  
Charge transfer clock pulse voltage  
Operating temperature  
mclk  
VTX1, VTX2, VTX3  
Topr  
Ta=25 °C  
No dew condensation*1  
No dew condensation*1  
-0.3 to Vdd(A) + 0.3  
-25 to +85  
-40 to +100  
260 °C max. 2 times (see P.10)  
V
°C  
°C  
-
Storage temperature  
Reow soldering conditions*2  
Tstg  
Tsol  
*1: When there is a temperature difference between a product and the surrounding area in high humidity environment, dew condensation  
may occur on the product surface. Dew condensation on the product may cause deterioration in characteristics and reliability.  
*2: JEDEC level 3  
Note: Exceeding the absolute maximum ratings even momentarily may cause a drop in product quality. Always be sure to use the  
product within the absolute maximum ratings.  
1
www.hamamatsu.com  

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