Datasheet > RS624

RS624

更新时间： 2024-04-09 18:58:22

品牌	Logo	应用领域
润石 - RUNIC		/
页数	文件大小	规格书
27页	735K
描述
The RS62X families of products offer low voltage operation and rail-to-rail input and output, as well as excellent speed/power consumption ratio

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RS624 数据手册

RS621S, RS622S, RS62X

Thermal Information:RS622

RS622

8PINS

THERMAL METRIC ⁽¹⁾

UNIT

TSSOP

MSOP-

TDFN2×

2-8L

TDFN3×

3-8L

SOIC-8

116

MSOP-8

165

-8

Junction-to-ambient thermal

resistance

R_ϴJA

200.7

169.5

84.1

113

80.1

100

66.9

54.5

40.4

1.9

°C /W

Junction-to-case(top)

R_ϴJC(top)

95.4

128.6

27.2

thermal resistance

Junction-to-board thermal

resistance

R_ϴJB

Junction-to-top

Ѱ_JT

12.8

98.3

N/A

4.9

15.8

111.6

N/A

6.8

characterization parameter

Junction-to-board

Ѱ_JB

127.2

N/A

45.2

22.7

40.4

10.8

characterization parameter

Junction-to-case(bottom)

R_ϴJC(bot)

N/A

thermal resistance

Thermal Information:RS624

RS624

14PINS

THERMAL METRIC ⁽¹⁾

UNIT

SOIC-14

83.8

TSSOP-14

R_ϴJA

Junction-to-ambient thermal resistance

Junction-to-case(top) thermal resistance

Junction-to-board thermal resistance

Junction-to-top characterization parameter

120.8

34.3

62.8

°C /W

R_ϴJC(top)

R_ϴJB

70.7

59.5

Ѱ_JT

Ѱ_JB

11.6

Junction-to-board characterization parameter

Junction-to-case(bottom) thermal resistance

37.7

56.5

N/A

R_ϴJC(bot)

N/A

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