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RS2G32 PDF预览

RS2G32

更新时间: 2024-04-09 19:00:50
品牌 Logo 应用领域
润石 - RUNIC /
页数 文件大小 规格书
10页 566K
描述
逻辑

RS2G32 数据手册

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RS2G32  
Specifications  
Absolute Maximum Ratings (1)  
over operating free-air temperature range (unless otherwise noted) (1)(2)  
MIN  
-0.5  
-0.5  
MAX  
6.5  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range (2)  
V
6.5  
Voltage range applied to any output in the high-impedance or power-off  
state(2)  
Voltage range applied to any output in the high or low state (2)(3)  
Vo  
V
V
-0.5  
-0.5  
6.5  
Vo  
IIK  
VCC+0.5  
-50  
Input clamp current  
VI<0  
mA  
mA  
mA  
mA  
°C  
IOK  
IO  
Output clamp current  
VO<0  
-50  
Continuous output current  
Continuous current through VCC or GND  
Junction temperature  
±50  
±100  
150  
TJ  
-65  
-65  
Tstg  
Storage temperature  
°C  
150  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating  
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCC is provided in the Recommended Operating Conditions table.  
ESD Ratings  
VALUE  
UNIT  
V
V
Human-body model (HBM)  
Machine model (MM)  
±8000  
±500  
V(ESD)  
Electrostatic discharge  
Thermal Information:  
RS2G32  
8PINS  
THERMAL METRIC  
UNIT  
MSOP-8  
RϴJA  
Junction-to-ambient thermal resistance  
165  
53  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
RϴJC(top)  
RϴJB  
Junction-to-case(top) thermal resistance  
Junction-to-board thermal resistance  
87  
ѰJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case(bottom) thermal resistance  
4.9  
85  
ѰJB  
RϴJC(bot)  
N/A  
4 / 10  
www.run-ic.com  

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