Datasheet > RL1005-2-R100F

RL1005-2-R100F

更新时间： 2022-04-24 19:39:31

品牌	Logo	应用领域
DAESAN		/
页数	文件大小	规格书
8页	236K
描述
1/8W, 0402 Low Resistance Chip Resistor (Lead / Halogen free)

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数据手册

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RL1005-2-R100F 数据手册

DOCUMENT : SR120000NH

REVISION

PAGE

: A2

: 3 OF 8

SPECIFICATION FOR APPROVAL

5. Characteristics

Test Item

Condition of Test

Requirements

∆R : ± (0.5%+0.0005

Short Time Overload

2.5 * Rated power for 5 seconds

Refer to JIS C 5201-1 4.13

Ω)

Without significant damage by

flashover ( spark, arching ), burning

or breakdown etc.

Insulation Resistance

The resistor shall be cramped in the

Between Electrode and Protection

metal block and tested , as shown below. Film 100MΩ or over

Test voltage : 100 ± 15V_DCfor 1 minute Between Electrode and Substrate

Refer to JIS C 5201-1 4.6 Mounting

condition G.

1,000MΩ or over

Voltage Proof

The voltage : 100V_AC(rms.) for 1 minute ∆R : ± (0.5%+0.0005Ω)

Refer to JIS C 5201-1 4.7

Without damage by flashover, fire

or breakdown, as shown below.

Thermal Shock

-55 ~125℃ 5 cycles, 15 min at each

extreme condition

∆R : ± (1.0%+0.0005Ω)

Without distinct damage in

appearance

Refer to JIS C 5201-1 4.19

Low Temperature Storage

Kept at -55℃, 1,000 hours

∆R : ± (1.0%+0.0005Ω)

Refer to JIS C 5201-1 4.23.4

Without distinct damage in

appearance

High Temperature Exposure

Solderability

Kept at 125℃ for 1,000 hours

∆R : ± (1.0%+0.0005Ω)

Refer to JIS C 5201-1 4.23.2

Without distinct damage in

appearance

Temperature of Solder : 245 ± 5℃

Immersion Duration : 2 ± 0.5 second

Refer to JIS C 5201-1 4.17

Uniform coating of solder cover

minimum of 95% surface being

immersed

Resistance to Soldering Heat

Dipped into solder at 270 ± 5℃

for 10 ± 1 seconds

∆R : ± (0.5%+0.0005Ω)

Without distinct deformation in

appearance

Refer to JIS C 5201-1 4.18

1 234 5 6 7 8

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