Contents
1
Introduction..................................................................................................................9
1.1
Terminology.........................................................................................................11
1.1.1 Processor Packaging Terminology.........................................................11
References..........................................................................................................12
1.2
2
Electrical Specifications........................................................................................15
2.1
2.2
2.3
System Bus and GTLREF...................................................................................15
Power and Ground Pins ......................................................................................15
Decoupling Guidelines ........................................................................................16
2.3.1 VCC Decoupling.....................................................................................16
2.3.2 System Bus AGTL+ Decoupling.............................................................16
Voltage Identification...........................................................................................16
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................18
Reserved, Unused Pins, and TESTHI[12:0]........................................................20
System Bus Signal Groups .................................................................................21
Asynchronous GTL+ Signals...............................................................................22
Test Access Port (TAP) Connection....................................................................22
System Bus Frequency Select Signals (BSEL[1:0])............................................22
Maximum Ratings................................................................................................23
Processor DC Specifications...............................................................................23
AGTL+ System Bus Specifications .....................................................................35
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
3
Package Mechanical Specifications.................................................................37
3.1
3.2
3.3
3.4
3.5
Package Load Specifications ..............................................................................40
Processor Insertion Specifications ......................................................................41
Processor Mass Specifications ...........................................................................41
Processor Materials.............................................................................................41
Processor Markings.............................................................................................42
4
5
Pin Lists and Signal Descriptions.....................................................................45
4.1
4.2
Processor Pin Assignments ................................................................................45
Signal Descriptions..............................................................................................58
Thermal Specifications and Design Considerations.................................67
5.1
Processor Thermal Specifications.......................................................................68
5.1.1 Thermal Specifications...........................................................................68
5.1.2 Thermal Metrology .................................................................................70
5.1.2.1 Processor Case Temperature Measurement ............................70
6
Features .......................................................................................................................71
6.1
6.2
Power-On Configuration Options ........................................................................71
Clock Control and Low Power States..................................................................71
6.2.1 Normal State—State 1 ...........................................................................71
6.2.2 AutoHALT Powerdown State—State 2...................................................72
6.2.3 Stop-Grant State—State 3 .....................................................................73
6.2.4 HALT/Grant Snoop State—State 4 ........................................................73
6.2.5 Sleep State—State 5..............................................................................74
Intel® Pentium® 4 Processor on 0.13 Micron Process Datasheet
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