R1190x
ELECTRICAL CHARACTERISTICS
VIN=CE=Set VOUT + 2.0V, CIN=4.7µF, COUT=4.7µF, IOUT=1mA unless otherwise noted.
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values indicate −40°C Ta 85°C, unless otherwise noted.
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R1190xxxx
Ta=25°C
Symbol
Item
Conditions
MIN.
TYP.
MAX.
x 1.015
x 1.027
Unit
x 0.985
x 0.973
Ta=25°C
VOUT
Output Voltage
IOUT=1mA
V
-40°C Ta 85°C
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IOUT
Output Current
Load Regulation
Please see the following table *(1)
ΔVOUT
/ΔIOUT
Please see the following table *(2)
VDIF
ISS
Dropout Voltage
Supply Current
Please see the following table *(3)
150
IOUT=0mA
220
1.0
µA
µA
Supply Current
(CE Off State)
VIN=16V
VCE=0V
Istandby
0.1
ΔVOUT
/ΔVIN
VOUT+0.5V(Min. 3.5V)
V
IN
16V
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Line Regulation
Ripple Rejection
0.02
60
0.10
%/V
I
OUT=1mA
f=1kHz
OUT=100mA
RR
VIN
dB
V
I
Input Voltage
3.5
16
IOUT=1mA
ppm
/°C
ΔVOUT
/ΔTa
Output Voltage
Temperature Coefficient
±100
-40°C Ta 85°C
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ILIM
Short Current Limit
VOUT=0V
300
mA
V
VCEH
VCEL
CE Input Voltage "H"
CE Input Voltage "L"
1.6
0.0
VIN
0.6
V
Thermal Shutdown
Temperature
TTSD
TTSR
Junction Temperature
Junction Temperature
150
130
°C
°C
Thermal Shutdown
Released Temperature
Nch On Resistance
for Auto Discharge
(D Version Only)
VIN=5.0V
VCE=0V
RLOW
100
Ω
VOUT=0.3V
The specification in
is checked and guaranteed by design engineering.
All of units are tested and specified under pulse load conditions such that Tj≈Ta=25°C except for Ripple Rejection, Output
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Voltage Temperature Coefficient items, Thermal Shutdown, Load Regulation at 0.1mA VOUT 600mA(2.0 VOUT<2.5V)
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and at 0.1mA VOUT 700mA(2.5 VOUT<3.3V) and at 0.1mA VOUT 1000mA(3.3 VOUT 12.0V), Dropout Voltage
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at IOUT=600mA(2.0 VOUT<2.5V) and at IOUT=700mA(2.5 VOUT<3.3V) and at IOUT=1000mA(3.3 VOUT 12.0V)
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RECOMMENDED OPERATING CONDITIONS (ELECTRICAL CHARACTERISTICS)
All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended
operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions,
even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices
may receive serious damage when they continue to operate over the recommended operating conditions.
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