Circuit Board Materials
電子回路基板材料
Ultra-low transmission loss Highly heat resistant
Multi-layer circuit board materials
Laminate R-5775(N)* R-5775(K) R-5775(G) R-5775(S)* R-5775(R)
ꢀ
超低伝送損失・高耐熱多層基板材料
Prepreg R-5670(N)* R-5670(K) R-5670(G)ꢀ
*Low Dk glass cloth type R-5775(S)/R-5775(R): Buried Resistor Copper Foil
Applications ⽤途
ICT infrastructure equipment, Supercomputer, Measuring instrument,
Antenna(Base station, Automotive millimeter-wave radar), Etc.
ICT インフラ機器 ( スーパーコンピュータ、計測⽤機器 )、
アンテナ ( 基地局、 載ミリ波レーダ )、高周波⽤途など
Network
ネットワーク
Wireless
ワイヤレス通信
The industry standard for high speed, ultra-low loss PCB material.
Excellent HDI and thermal performance.
Better
High end zone
Ultra-Low loss
超高性能サーバやルータ向け材料のデファクトスタンダード。
低伝送ロスを実現し、超高性能サーバやルータの性能向上に貢
献
High end/ volume zone
Low loss
Volume zone
Middle Loss
Dk 3.4 Df 0.004
@12GHz
Tg (DSC)
185℃
T288 (with copper)
>120min
■ Frequency dependence by Transmission loss
■ Heat resistance of High Multi-layered
ꢀ高多層耐熱性
ꢀ伝送損失比較
0
●
Result
Drill diameter
Wall to wall distance
φ0.3mm
-50
R-5775(N) H-VLP
Low Dk glass cloth
0.5mm
pass
0.6mm
pass
-100
-150
-200
-250
(Low Dk glass cloth)
R-5775(K)/R-5775(G)
H-VLP
●
●
Condition
Normal Glass cloth
260℃ reflow x 10times
0
20
40
60
Frequency (GHz)
80
100
Construction
32 Layers
ꢁConstruction
Microstrip line
Board thickness: 4.5mm
Measurement
2 port S-Parameter
10MHz-110GHz
Sig
Frequency
PCB
Thickness ; 0.100mm
ꢀꢀꢀꢀꢀꢀ(4mil)
GND
De-embedded
Multiline TRL method
Measurement line adjust to 50Ω(Zo)
Layer1 : Signal Line
Layer2 : GND Plane
(line width : 270μm)
(Cu thickness : 24μm)
(Cu thickness : 24μm)
■ General propertiesꢀ⼀般特性
R-5775(S)
R-5775(R)
Item
Test method
Condition Unit
R-5775(N)
R-5775(K)/R-5775(G)
Low Dk glass cloth
Normal glass cloth
Low Dk glass cloth Normal glass cloth
Buried Resistor Copper Foil Buried Resistor Copper Foil
Tg
CTE z-axis
DSC
A
℃
ppm/℃
min
185
45
185
45
185
45
185
45
α1
α2
IPC-TM-650 2.4.24
IPC-TM-650 2.4.24.1
A
260
>120
3.4
260
>120
3.6
260
260
T288(with copper)
Dk
A
C-24/23/50
A
>120
3.4
>120
3.6
Balanced-type
circular disk resonator
12GHz
-
Df
0.004
0.8
0.004
0.8
0.004
0.8*²
0.004
0.8*²
Peel strength*¹ 1oz(35μm) IPC-TM-650 2.4.8
kN/m
The sample thickness is 0.75mm.
*1 H-VLP Copper *2 Buried Resistor Copper Foil 1/2oz (18μm)
The above data are typical values and not guaranteed values. 上記データは当社測定による代表値であり、保証値ではありません。
Please see the page for “Notes before you use” 商品のご採用に当たっての注意事項は こちら
Ⓒ Panasonic Industry Co., Ltd.ꢀ202205
industrial.panasonic.com/ww/electronic-materials
panasonic R-5775