F-213
QTH–090–01–C–D–A
®
(0,50 mm) .0197"
QTH SERIES
QTH–030–01–L–D–A
QTH–060–07–F–D–A
HIGH SPEED GROUND PLANE HEADER
Integral metal plane for
power or ground
Standard Stack Heights
from 5 mm to 25 mm
Board Mates:
QSH
SPECIFICATIONS
®
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTH
Cable Mates:
HQCD, HQDP
(See Application Specific note)
Insulator Material:
Liquid Crystal
Polymer
TM
Terminal Material:
Phosphor Bronze
Plating:
EXTENDED LIFE PRODUCT
Au or Sn over
10 year Mixed Flowing Gas with 50µ" Gold
Call Samtec for maximum cycles mated with QSH
50µ" (1,27 µm) Ni
Current Rating:
Contact:
1.0A per contact @ 30°C
Temperature Rise
Ground Plane:
Rated @ 3dB Insertion Loss
with PCB effects* w/o PCB effects**
9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
QTH/QSH
Type
5 mm Stack Height
7.8A per ground plane @ 30°C
Temperature Rise
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles:
Single-Ended Signaling
Differential Pair Signaling
Differential Pair Signaling
–D
–D
–DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
100
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
RoHS Compliant:
Yes
Processing:
LEAD
PINS PER ROW
NO. OF PAIRS
PLATING
OTHER
Lead–Free Solderable:
Yes
TYPE
QTH
A
STYLE
OPTION
OPTION
SMT Lead Coplanarity:
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
Specify
LEAD
STYLE
from
–K
= (7,00 mm)
.275" DIA
–F
–D
–030, –060, –090
= Gold Flash on
Signal Pins and
Ground Plane,
MatteTin on tails
= Single-Ended
(60 total pins per bank = –D)
Polyimide
film Pick &
Place Pad
(N/A with -05 &
-07 lead style)
chart
–D–DP
= Differential Pair
(–01 only)
–020, –040, –060
APPLICATION
SPECIFIC OPTION
• 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
(20 pairs per bank = –D–DP)
–L
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
= 10µ" (0,25 µm)
Gold on Signal Pins
and Ground Plane,
MatteTin on tails
–TR
= Tape & Reel
(–090 positions
maximum)
(20,00) .7875
QTH
LEAD
STYLE
HEIGHT
WITH
QSH*
01
machines may have
component height
A
(7,11)
.280
–C*
(4,27) (5,00)
–L
= Latching
Option
(–01 lead
style only)
(N/A on
–060 (–D–DP),
–080, –090
& –120)
restrictions. Please consult
machinery specifications.)
• 30µ" (0,76 µm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
• Edge Mount & Guide Posts
• 80 (-DP), 120, 150
positions per row
–01
–02
–03
–04
–05
–07
= Electro-Polished
Selective
.168 .197
02
(7,26) (8,00)
.286 .315
(0,50)
.0197
(0,20)
.008
50µ" (1,27 µm) min Au
over 150µ" (3,81 µm)
Ni on Signal Pins in
contact area,
10µ" (0,25 µm) min Au
over 50µ" (1,27 µm)
Ni on Ground Plane
in contact area,
(10,27) (11,00)
.404 .433
A
(15,25) (16,00)
.600 .630
A
(18,26) (19,00)
.718 .748
–01 & –02
(24,24) (25,00)
.954 .984
–03 thru –07
MatteTin over 50µ"
(1,27 µm) min Ni
on all solder tails
• Retention Option
Call Samtec.
*Processing conditions
will affect mated height.
(0,76)
.030
ALSO AVAILABLE
Board Spacing Standoffs.
See SO Series.
*Note: –C Plating passes
(0,64)
.025
(0,89)
.035
DIA
10 year MFG testing
–L
Note: Some lengths, styles
and options are non-standard,
non-returnable.
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