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QSE-014-01-S-D-DP-EM2-GP PDF预览

QSE-014-01-S-D-DP-EM2-GP

更新时间: 2024-02-28 03:10:08
品牌 Logo 应用领域
申泰 - SAMTEC 连接器
页数 文件大小 规格书
2页 171K
描述
Board Connector

QSE-014-01-S-D-DP-EM2-GP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:ActiveReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8536.69.40.40
风险等级:5.74连接器类型:BOARD CONNECTOR
联系完成配合:GOLD (30)联系完成终止:MATTE TIN
触点材料:PHOSPHOR BRONZEJESD-609代码:e3
Base Number Matches:1

QSE-014-01-S-D-DP-EM2-GP 数据手册

 浏览型号QSE-014-01-S-D-DP-EM2-GP的Datasheet PDF文件第2页 
FIG 1  
REVISION U  
QSE-XXX-01-X-D-DP-EMX-XX  
QSE-042-01-X-D-DP-EMX SHOWN  
OPTION  
-GP: GUIDE POST  
(SEE FIG 3, SHEET 2)  
No OF PAIRS  
ASO ONLY (APPLICATION SPECIFIC ORDER)  
*
-014, -028, -042  
** -056, **-070  
(PER ROW)  
EM3-GP=NOT TOOLED  
*
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF  
** SEE NOTE 11  
EDGE MOUNT THICKNESS  
C
LEAD STYLE  
-EM2: .064[1.63] +/-.004 PCB  
(USE QSE-20-01-D-EM2-XX & C-162-01-X)  
-01: .1380[3.505]  
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF  
.793 20.130 REF  
U
-EM3: (USE QSE-20-01-D-EM3-XX  
& C-162-02-X)  
PLATING SPECIFICATION  
SEE NOTE 10  
02  
PLATING THICKNESSES ARE FOR  
SIGNAL PINS ONLY. FOR GROUND  
PLANE THICKNESSES, SEE PP-T-1G13-XX-X.  
-F: 3µ" FLASH SELECTIVE GOLD IN CONTACT  
AREA MATTE TIN ON TAIL (SEE NOTE 6)  
(USE C-162-XX-F & T-1G13-01-F)  
-L: 10µ" LIGHT SELECTIVE GOLD IN CONTACT  
AREA WITH MATTE TIN ON TAIL  
DIFFERENTIAL PAIR  
.2850 7.239  
REF  
DO NOT  
SCALE FROM  
THIS PRINT  
ROW SPECIFICATION  
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)  
01  
.6250 15.875  
'D'  
.0225 0.571  
REF  
(USE C-162-XX-L & T-1G13-01-L)  
-H: 30µ" HEAVY GOLD IN CONTACT AREA,  
3µ" FLASH GOLD ON TAIL  
No OF BANKS  
REF  
6 EQ SPACES  
@ .0945 [2.400]  
(USE C-162-XX-H & T-1G13-01-G)  
-TL: TIN/LEAD (90/10 5%) CONTACT AND TAIL  
-S: 30µ" SELECTIVE GOLD IN CONTACT AREA,  
(USE C-162-XX-S & T-1G13-01-L)  
MATTE TIN ON TAIL  
U
C
.1180 2.997  
C-162-02-X  
QSE-20-01-D-EMX-03  
QSE-20-01-D-EM2-XX  
C-162-01-X  
.175 4.45  
REF  
QSE-20-01-D-EM3-XX  
SEE NOTE 12  
.120 3.05 REF  
"A"  
U
SEE NOTE 5  
.2380 6.045  
REF  
SEE TABLE 1  
C
"A"  
.0920±.0030 2.338±0.076  
.1370±.0030 3.480±0.08  
C
.0890 2.261 REF  
C
T-1G13-01-X  
.7250 18.415  
REF  
.0660±.0030 1.676±0.076  
.0580 1.473 REF  
2
MAX SWAY  
(TYP)  
.1545 3.924  
SECTION "A-A"  
SECTION "A"-"A"  
.1200 3.048  
REF  
.0060 0.152  
REF  
EDGE MOUNT THICKNESS  
-EM3:  
(DIFFERENT AS SHOWN, OTHERWISE  
SAME AS -EM2 PCB THICKNESS)  
(SEE NOTE 10)  
EDGE MOUNT THICKNESS  
-EM2: .064 [1.63] +/-.004 PCB  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. CONTACT RETENTION: 6 OZ MIN.  
3. GROUND PLANE RETENTION: 8 OZ MIN.  
4. PARTS ARE MOLD TO POSITION.  
5. MAX VARIANCE OF .002[.05].  
.0400 1.016 REF  
.0070 0.178 REF  
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.  
7. NOTE DELETED.  
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.  
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm  
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.  
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.  
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES  
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC  
INTERCONNECT PROCESSING GROUP.  
.1000 2.540 REF  
.1600 4.064 REF  
U
12. SIDE WALLS ARE RIBBED AS NECESSARY TO CONTROL BOW.  
PROPRIETARY NOTE  
UNLESS OTHERWISE SPECIFIED,  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
DECIMALS  
ANGLES  
.XX: .01[.3]  
2
520 PARK EASTBLVD, NEW ALBANY, IN 47150  
.XXX: .005[.13]  
PHONE: 812-944-6733  
e-Mail: info@SAMTEC.com  
FAX: 812-948-5047  
code: 55322  
.XXXX: .0020[.051]  
TABLE 1  
MATERIAL:  
DO NOT SCALE DRAWING  
SHEETSCALE: 1.25:1  
DESCRIPTION:  
C
INSULATOR: LCP, UL 94VO  
COLOR: BLACK  
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY  
DWG. NO.  
GND PLANE  
COPLANARITY  
ASSEMBLY  
BOW  
U
No OF PAIRS  
QSE-XXX-01-X-D-DP-EMX-XX  
CONTACT: PHOS BRONZE  
GROUND PLANE: PHOS BRONZE  
-014 THRU -042  
-056 THRU -070  
.004 [.10]  
.005[1.27]  
.004 [.10]  
.005[1.27]  
SHEET1 OF 2  
BY:  
DEAN P  
4/10/2001  
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW  

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