SMD POWER INDUCTOR
◆推荐使用的焊接曲线
Recommended soldering profile
* 本产品建议使用回流焊接法
Applicable soldering process to the products is reflow soldering.
* 焊接材料
焊料:Sn-3.0Ag-0.5Cu
Solder:Sn-3.0Ag-0.5Cu
助焊剂:使用松香基助焊剂,禁止使用卤化物含量超过 0.2wt%的强酸性助焊剂和水溶性助焊剂。
Flux: Use rosin-based flux, but not strongly acidic flux (with chlorine exceeding 0.2 wt%). Do not use water-soluble
flux.
* 焊接曲线
Soldering Profile
◆贮存要求
Storage Requirements
* 存储期限:为保证电感的焊接特性和包装材料处于良好状态,请于本公司发货后 6 个月内使用本产品。同时,由于电感
的焊接特性会随时间发生变化,如果贮存时间超过 6 个月,请首先确认其焊接特性后再使用。
Storage Period: In order to ensure that the welding characteristics and packaging materials of the inductor are in good
condition, please use this product within 6 months after the company ships it. At the same time, because the welding
characteristics of the inductor will change with time, if the storage time exceeds 6 months, please confirm its welding
characteristics before use.
* 存储条件:
温度:-10 to +40℃(编带包装的电感器);-40 to +85℃(电感器本体)
相对湿度: 30~70%RH
Storage Conditions:
Temperature: -10 to +40℃( Inductors With Taping); -40 to +85℃(Inductors Body)
Humidity:30~70%RH
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