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PIC32MX130F128HT-50I/MR PDF预览

PIC32MX130F128HT-50I/MR

更新时间: 2024-02-27 15:36:50
品牌 Logo 应用领域
美国微芯 - MICROCHIP 时钟外围集成电路
页数 文件大小 规格书
382页 2970K
描述
IC MCU 32BIT 128KB FLASH 64QFN

PIC32MX130F128HT-50I/MR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:HVQCCN,
Reach Compliance Code:compliantFactory Lead Time:23 weeks
风险等级:5.77具有ADC:YES
地址总线宽度:位大小:32
最大时钟频率:50 MHzDAC 通道:NO
DMA 通道:YES外部数据总线宽度:
JESD-30 代码:S-PQCC-N64JESD-609代码:e3
长度:9 mmI/O 线路数量:53
端子数量:64片上程序ROM宽度:8
最高工作温度:85 °C最低工作温度:-40 °C
PWM 通道:YES封装主体材料:PLASTIC/EPOXY
封装代码:HVQCCN封装形状:SQUARE
封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILERAM(字节):16384
ROM(单词):131072ROM可编程性:FLASH
筛选级别:TS 16949座面最大高度:1 mm
速度:50 MHz最大供电电压:3.6 V
最小供电电压:2.3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn) - annealed
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD宽度:9 mm
uPs/uCs/外围集成电路类型:MICROCONTROLLER, RISCBase Number Matches:1

PIC32MX130F128HT-50I/MR 数据手册

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PIC32MX1XX/2XX/5XX 64/100-PIN  
32-bit Microcontrollers (up to 512 KB Flash and 64 KB SRAM) with  
Audio/Graphics/Touch (HMI), CAN, USB, and Advanced Analog  
Operating Conditions  
Timers/Output Compare/Input Capture  
• 2.3V to 3.6V, -40ºC to +105ºC (DC to 40 MHz),  
• Five General Purpose Timers:  
-40ºC to +85ºC (DC to 50 MHz)  
- Five 16-bit and up to two 32-bit Timers/Counters  
• Five Output Compare (OC) modules  
®
®
Core: 50 MHz/83 DMIPS MIPS32 M4K  
• MIPS16e® mode for up to 40% smaller code size  
• Code-efficient (C and Assembly) architecture  
• Five Input Capture (IC) modules  
• Peripheral Pin Select (PPS) to allow function remap  
• Real-Time Clock and Calendar (RTCC) module  
• Single-cycle (MAC) 32x16 and two-cycle 32x32 multiply  
Communication Interfaces  
Clock Management  
• 0.9% internal oscillator  
• Programmable PLLs and oscillator clock sources  
• Fail-Safe Clock Monitor (FSCM)  
• Independent Watchdog Timer  
• Fast wake-up and start-up  
• USB 2.0-compliant Full-speed OTG controller  
• Up to five UART modules (12.5 Mbps):  
- LIN 1.2 protocols and IrDA® support  
• Four 4-wire SPI modules (25 Mbps)  
• Two I2C modules (up to 1 Mbaud) with SMBus support  
• PPS to allow function remap  
Power Management  
• Parallel Master Port (PMP) with dual read/write buffers  
• Controller Area Network (CAN) 2.0B Compliant with  
DeviceNet™ addressing support  
• Low-power management modes (Sleep and Idle)  
• Integrated Power-on Reset, Brown-out Reset, and High  
Voltage Detect  
• 0.5 mA/MHz dynamic current (typical)  
• 44 μA IPD current (typical)  
Direct Memory Access (DMA)  
• Four channels of hardware DMA with automatic data  
size detection  
Audio/Graphics/Touch HMI Features  
• 32-bit Programmable Cyclic Redundancy Check (CRC)  
• Two additional channels dedicated to USB  
• Two additional channels dedicated to CAN  
• External graphics interface with up to 34 PMP pins  
• Audio data communication: I2S, LJ, RJ, USB  
• Audio data control interface: SPI and I2C  
• Audio data master clock:  
- Generation of fractional clock frequencies  
- Can be synchronized with USB clock  
- Can be tuned in run-time  
Input/Output  
• 10 mA or 15 mA source/sink for standard VOH/VOL and  
up to 22 mA for non-standard VOH  
1
• 5V-tolerant pins  
• Selectable open drain, pull-ups, and pull-downs  
• External interrupts on all I/O pins  
• Charge Time Measurement Unit (CTMU):  
- Supports mTouch® capacitive touch sensing  
- Provides high-resolution time measurement (1 ns)  
Qualification and Class B Support  
• AEC-Q100 REVG (Grade 2 -40ºC to +105ºC)  
Advanced Analog Features  
• ADC Module:  
• Class B Safety Library, IEC 60730  
- 10-bit 1 Msps rate with one Sample and Hold (S&H)  
- Up to 48 analog inputs  
Debugger Development Support  
• In-circuit and in-application programming  
- Can operate during Sleep mode  
• Flexible and independent ADC trigger sources  
• On-chip temperature measurement capability  
• Comparators:  
• 4-wire MIPS® Enhanced JTAG interface  
• Unlimited program and six complex data breakpoints  
• IEEE 1149.2-compatible (JTAG) boundary scan  
- Three dual-input Comparator modules  
- Programmable reference with 32 voltage points  
Packages  
Type  
QFN  
TQFP  
TFBGA (see Note 1)  
Pin Count  
I/O Pins (up to)  
Contact/Lead Pitch  
Dimensions  
64  
53  
64  
53  
100  
85  
100  
85  
100  
85  
0.50 mm  
9x9x0.9 mm  
0.50 mm  
10x10x1 mm  
0.40 mm  
12x12x1 mm  
0.50 mm  
14x14x1 mm  
0.65 mm  
7x7x1.2 mm  
Note 1:  
Please contact your local Microchip Sales Office for information regarding the availability of devices in the 100-pin TFBGA package.  
2014-2017 Microchip Technology Inc.  
DS60001290E-page 1  

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