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PIC32MX150F128DT-V/PT PDF预览

PIC32MX150F128DT-V/PT

更新时间: 2024-02-08 15:12:59
品牌 Logo 应用领域
美国微芯 - MICROCHIP 时钟微控制器外围集成电路
页数 文件大小 规格书
344页 2953K
描述
32-BIT, FLASH, 40 MHz, RISC MICROCONTROLLER, PQFP44, 10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TQFP-44

PIC32MX150F128DT-V/PT 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:QFP包装说明:10 X 10 MM, 1 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, TQFP-44
针数:44Reach Compliance Code:compliant
ECCN代码:3A991.A.2HTS代码:8542.31.00.01
风险等级:5.07具有ADC:YES
地址总线宽度:位大小:32
CPU系列:PIC最大时钟频率:40 MHz
DAC 通道:NODMA 通道:YES
外部数据总线宽度:JESD-30 代码:S-PQFP-G44
JESD-609代码:e3长度:10 mm
湿度敏感等级:3I/O 线路数量:34
端子数量:44最高工作温度:105 °C
最低工作温度:-40 °CPWM 通道:YES
封装主体材料:PLASTIC/EPOXY封装代码:TQFP
封装等效代码:TQFP44,.47SQ,32封装形状:SQUARE
封装形式:FLATPACK, THIN PROFILE峰值回流温度(摄氏度):260
电源:2.5/3.3 V认证状态:Not Qualified
RAM(字节):32768ROM(单词):131072
ROM可编程性:FLASH座面最大高度:1.2 mm
速度:40 MHz子类别:Microcontrollers
最大压摆率:30 mA最大供电电压:3.6 V
最小供电电压:2.3 V标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn) - annealed
端子形式:GULL WING端子节距:0.8 mm
端子位置:QUAD处于峰值回流温度下的最长时间:40
宽度:10 mmuPs/uCs/外围集成电路类型:MICROCONTROLLER, RISC
Base Number Matches:1

PIC32MX150F128DT-V/PT 数据手册

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PIC32MX1XX/2XX 28/36/44-PIN  
32-bit Microcontrollers (up to 256 KB Flash and 64 KB SRAM) with  
Audio and Graphics Interfaces, USB, and Advanced Analog  
Operating Conditions  
Timers/Output Compare/Input Capture  
• 2.3V to 3.6V, -40ºC to +105ºC, DC to 40 MHz  
• 2.3V to 3.6V, -40ºC to +85ºC, DC to 50 MHz  
• Five General Purpose Timers:  
- Five 16-bit and up to two 32-bit Timers/Counters  
• Five Output Compare (OC) modules  
®
®
Core: 50 MHz/83 DMIPS MIPS32 M4K  
• Five Input Capture (IC) modules  
• MIPS16e® mode for up to 40% smaller code size  
• Code-efficient (C and Assembly) architecture  
• Peripheral Pin Select (PPS) to allow function remap  
• Real-Time Clock and Calendar (RTCC) module  
• Single-cycle (MAC) 32x16 and two-cycle 32x32 multiply  
Communication Interfaces  
• USB 2.0-compliant Full-speed OTG controller  
• Two UART modules (12.5 Mbps):  
- Supports LIN 2.0 protocols and IrDA® support  
• Two 4-wire SPI modules (25 Mbps)  
• Two I2C modules (up to 1 Mbaud) with SMBus support  
• PPS to allow function remap  
Clock Management  
• 0.9% internal oscillator  
• Programmable PLLs and oscillator clock sources  
• Fail-Safe Clock Monitor (FSCM)  
• Independent Watchdog Timer  
• Fast wake-up and start-up  
• Parallel Master Port (PMP)  
Power Management  
• Low-power management modes (Sleep and Idle)  
• Integrated Power-on Reset and Brown-out Reset  
• 0.5 mA/MHz dynamic current (typical)  
• 44 μA IPD current (typical)  
Direct Memory Access (DMA)  
• Four channels of hardware DMA with automatic data  
size detection  
• Two additional channels dedicated for USB  
• Programmable Cyclic Redundancy Check (CRC)  
Audio Interface Features  
• Data communication: I2S, LJ, RJ, and DSP modes  
• Control interface: SPI and I2C  
• Master clock:  
Input/Output  
• 10 mA source/sink on all I/O pins and up to 14 mA on  
non-standard VOH  
- Generation of fractional clock frequencies  
- Can be synchronized with USB clock  
- Can be tuned in run-time  
• 5V-tolerant pins  
• Selectable open drain, pull-ups, and pull-downs  
• External interrupts on all I/O pins  
Advanced Analog Features  
• ADC Module:  
- 10-bit 1.1 Msps rate with one S&H  
- Up to 10 analog inputs on 28-pin devices and 13  
analog inputs on 44-pin devices  
• Flexible and independent ADC trigger sources  
• Charge Time Measurement Unit (CTMU):  
- Supports mTouch™ capacitive touch sensing  
- Provides high-resolution time measurement (1 ns)  
Qualification and Class B Support  
• AEC-Q100 REVG (Grade 2 -40ºC to +105ºC) planned  
• Class B Safety Library, IEC 60730  
Debugger Development Support  
• In-circuit and in-application programming  
• 4-wire MIPS® Enhanced JTAG interface  
• Unlimited program and six complex data breakpoints  
• IEEE 1149.2-compatible (JTAG) boundary scan  
- On-chip temperature measurement capability  
• Comparators:  
- Up to three Analog Comparator modules  
- Programmable references with 32 voltage points  
Packages  
Type  
SOIC  
SSOP  
SPDIP  
QFN  
VTLA  
TQFP  
Pin Count  
I/O Pins (up to)  
Contact/Lead Pitch  
Dimensions  
28  
28  
21  
28  
21  
28  
21  
44  
34  
36  
25  
44  
34  
44  
34  
21  
1.27  
0.65  
0.100''  
0.65  
0.65  
0.50  
0.50  
0.80  
17.90x7.50x2.65  
10.2x5.3x2  
1.365''x.285''x.135'' 6x6x0.9  
8x8x0.9  
5x5x0.9  
6x6x0.9  
10x10x1  
Note: All dimensions are in millimeters (mm) unless specified.  
2011-2016 Microchip Technology Inc.  
DS60001168J-page 1  
 

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