SPICE MODEL: PDS560
PDS560
5A SCHOTTKY BARRIER RECTIFIER
ä
PowerDI 5
Features
·
Guard Ring Die Construction for
Transient Protection
A
D
·
·
·
·
High Surge Current Capability
Low Leakage Current
A2
b2
ä
PowerDI 5
L1
L1
Low Power Loss, High Efficiency
Min
1.05
0.33
0.80
1.70
3.90
Max
1.15
0.43
0.99
1.88
4.05
Dim
A
E
E1
For Use in High Frequency Inverters, Free Wheeling, and
Polarity Protection Applications
A2
b1
b2
D
·
·
·
·
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
e
A2
b1
b1
D
D2
b2
D2
E
3.05 NOM
L
6.40
6.60
Mechanical Data
e
1.84 NOM
Case: PowerDIä5
E2
E
·
·
E1
E2
L
5.30
5.45
Case Material: Molded Plastic, “Green” Molding
W
L1
3.55 NOM
Compound. UL Flammability Classification Rating 94V-0
0.75
0.50
1.20
0.95
0.65
1.50
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
e
b1
b1
Terminals: Finish – Matte Tin annealed over Copper
L1
W
e
3
leadframe. Solderable per MIL-STD-202, Method 208
LEFT PIN
BOTTOMSIDE
HEAT SINK
·
·
·
Polarity: See Diagram
RIGHT PIN
All Dimensions in mm
Marking: See Page 3
Note: Pins Left & Right must
be electrically connected
at the printed circuit board.
Weight: 0.094 grams (approximate)
@ TA = 25°C unless otherwise specified
Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Value
Characteristic
Symbol
Unit
VRRM
VRWM
VR
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
60
V
VR(RMS)
IO
RMS Reverse Voltage
42
5
V
A
Average Rectified Output Current (see figure 4)
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
IFSM
120
A
Tj
Operating Temperature Range
Storage Temperature Range
-65 to +150
-65 to +150
°C
°C
TSTG
@ TA = 25°C unless otherwise specified
Thermal Characteristics
Characteristic
Symbol
Typ
¾
Max
2.0
¾
Unit
°C/W
°C/W
°C/W
°C/W
RqJS
RqJA
RqJA
RqJA
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2)
Thermal Resistance Junction to Ambient Air (Note 3)
Thermal Resistance Junction to Ambient Air (Note 4)
95
70
50
¾
¾
Notes:
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm.
DS30480 Rev. 9 - 2
1 of 3
PDS560
PowerDI is a trademark of Diodes Incorporated.
www.diodes.com
ã Diodes Incorporated