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PDR3G_1

更新时间： 2024-02-25 19:48:30
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3页 410K
描述
3A GLASS PASSIVATED RECTIFIER

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中文翻译

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PDR3G_1 数据手册

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PDR3G  
3A GLASS PASSIVATED RECTIFIER  
ä
PowerDI 5  
Features  
·
·
·
·
·
·
Glass Passivated Die Construction  
A
D
b2  
Low Leakage Current  
A2  
ä
PowerDI 5  
L1  
High Forward Surge Current Capability  
Lead Free Finish, RoHS Compliant (Note 1)  
"Green" Molding Compound (No Br, Sb)  
Qualified to AEC-Q101 Standards for High Reliability  
Min  
1.05  
0.33  
0.80  
1.70  
3.90  
Max  
1.15  
0.43  
0.99  
1.88  
4.05  
Dim  
A
E
E1  
A2  
b1  
b2  
D
L1  
e
A2  
b1  
b1  
Mechanical Data  
ä
D
·
Case: PowerDI 5  
D2  
b2  
D2  
E
3.05 NOM  
·
Case Material: Molded Plastic, “Green” Molding  
Compound. UL Flammability Classification Rating 94V-0  
L
6.40  
6.60  
e
1.84 NOM  
·
·
Moisture Sensitivity: Level 1 per J-STD-020C  
E2  
E
Terminals: Finish – Matte Tin annealed over Copper  
leadframe. Solderable per MIL-STD-202, Method 208  
E1  
E2  
L
5.30  
5.45  
W
e3  
L1  
3.55 NOM  
·
·
·
Polarity: See Diagram  
e
0.75  
0.50  
1.20  
0.95  
0.65  
1.50  
Marking: See Page 3  
b1  
b1  
L1  
W
Weight: 0.095 grams (approximate)  
LEFT PIN  
BOTTOMSIDE  
HEAT SINK  
RIGHT PIN  
All Dimensions in mm  
Note: Pins Left & Right must  
be electrically connected  
at the printed circuit board.  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Single phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
Value  
Characteristic  
Symbol  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
400  
V
VR(RMS)  
IO  
RMS Reverse Voltage  
283  
3
V
A
Average Rectified Output Current (See also figure 4)  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine-wave Superimposed on Rated Load  
IFSM  
100  
A
Thermal Characteristics  
Characteristic  
Symbol  
Typ  
Max  
2.0  
¾
Unit  
°C/W  
°C/W  
°C/W  
°C/W  
°C  
R
qJS  
Thermal Resistance Junction to Soldering Point  
Thermal Resistance Junction to Ambient Air (Note 2)  
Thermal Resistance Junction to Ambient Air (Note 3)  
Thermal Resistance Junction to Ambient Air (Note 4)  
Operating Temperature Range  
¾
75  
65  
45  
R
qJA  
R
qJA  
¾
R
qJA  
¾
Tj  
-65 to +150  
-65 to +150  
TSTG  
Storage Temperature Range  
°C  
Notes:  
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.  
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C  
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf. TA = 25°C  
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4mm x 7.2mm. Anode pad dimensions 2.7mm x 1.6mm. TA = 25°C  
DS30547 Rev. 7 - 2  
1 of 3  
PDR3G  
PowerDI is a trademark of Diodes Incorporated.  
www.diodes.com  
ã Diodes Incorporated  
123

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