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PDR5G

更新时间: 2024-09-21 03:42:47
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美台 - DIODES /
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3页 78K
描述
5A GLASS PASSIVATED RECTIFIER

PDR5G 数据手册

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SPICE MODEL: PDR5G  
PDR5G  
5A GLASS PASSIVATED RECTIFIER  
ä
PowerDI 5  
Features  
A
·
·
·
·
·
Glass Passivated Die Construction  
D
b2  
A2  
Low Leakage Current  
L1  
L1  
ä
PowerDI 5  
Lead Free Finish, RoHS Compliant (Note 1)  
"Green" Molding Compound (No Br, Sb)  
Qualified to AEC-Q101 Standards for High Reliability  
Min  
1.05  
0.33  
0.80  
1.70  
3.90  
Max  
1.15  
0.43  
0.99  
1.88  
4.05  
Dim  
A
E
E1  
A2  
b1  
b2  
D
e
A2  
b1  
b1  
Mechanical Data  
D
D2  
b2  
3.05 NOM  
·
·
Case: PowerDIä5  
D2  
E
L
Case Material: Molded Plastic, “Green” Molding  
6.40  
6.60  
Compound. UL Flammability Classification Rating 94V-0  
1.84 NOM  
E2  
e
E
·
·
Moisture Sensitivity: Level 1 per J-STD-020C  
E1  
E2  
L
5.30  
5.45  
W
Terminals: Finish – Matte Tin annealed over Copper  
L1  
3.55 NOM  
e
3
leadframe. Solderable per MIL-STD-202, Method 208  
e
0.75  
0.50  
1.20  
0.95  
0.65  
1.50  
·
·
·
Polarity: See Diagram  
b1  
b1  
L1  
W
Marking: See Page 3  
LEFT PIN  
Weight: 0.096 grams (approximate)  
BOTTOMSIDE  
HEAT SINK  
RIGHT PIN  
All Dimensions in mm  
Note: Pins Left & Right must  
be electrically connected  
at the printed circuit board.  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Single phase, half wave, 60Hz, resistive or inductive load.  
For capacitive load, derate current by 20%.  
Value  
Characteristic  
Symbol  
Unit  
VRRM  
VRWM  
VR  
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
400  
V
VR(RMS)  
IO  
RMS Reverse Voltage  
283  
5
V
A
Average Rectified Output Current (See also figure 4)  
Non-Repetitive Peak Forward Surge Current  
8.3ms Single half sine-wave Superimposed on Rated Load  
IFSM  
100  
A
Tj  
Operating Temperature Range  
Storage Temperature Range  
-65 to +150  
-65 to +150  
°C  
°C  
TSTG  
@ TA = 25°C unless otherwise specified  
Thermal Characteristics  
Characteristic  
Symbol  
RqJS  
Typ  
Max  
1.5  
¾
Unit  
°C/W  
°C/W  
°C/W  
°C/W  
Thermal Resistance Junction to Soldering Point  
Thermal Resistance Junction to Ambient Air (Note 2)  
Thermal Resistance Junction to Ambient Air (Note 3)  
Thermal Resistance Junction to Ambient Air (Note 4)  
¾
75  
65  
45  
RqJA  
RqJA  
¾
RqJA  
¾
Notes:  
1. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.  
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.  
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.  
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4 mm x 7.2 mm. Anode pad dimensions 2.7 mm x 1.6 mm.  
DS30552 Rev. 5 - 2  
1 of 3  
PDR5G  
PowerDI is a trademark of Diodes Incorporated.  
www.diodes.com  
ã Diodes Incorporated  

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