Freescale Semiconductor, Inc.
MAXIMUM RATINGS
All voltages are with respect to ground unless otherwise noted.
Rating
Symbol
Value
Unit
ELECTRICAL RATINGS
Power Supply Voltage
Steady-State
V
V
PWR
-16 to 41
-0.3 to 7.0
-5.0 to 41
40
Input/Output Terminals Voltage (Note 1)
Output Voltage
V
V
V
IN
V
OUT
OUT
Continuous Output Current (Note 2)
CSNS Input Clamp Current
SR Voltage
I
A
I
10
mA
V
CSNS
VSR
-0.3 to 54
-0.3 to 5.0
-0.3 to 54
Temperature Feedback Voltage
VTEMP
V
C
V
C
Voltage
BOOT
BOOT
OCLS Voltage
V
-0.3 to 7.0
-0.3 to 15
-5.0 to 41
V
V
V
V
OCLS
Low-Side Gate Voltage
Low-Side Drain Voltage
V
GLS
V
DLS
ESD Voltage
V
V
±2000
±200
ESD1
ESD2
Human Body Model (Note 3)
Machine Model (Note 4)
Output Clamp Energy (Note 5)
E
TBD
J
CL
THERMAL RATINGS
°C
Operating Temperature
Ambient
T
A
-40 to 125
-40 to 150
T
Junction
J
Storage Temperature
T
-55 to 150
°C
STG
Thermal Resistance (Note 6)
Junction to Power Die Case
Junction to Ambient
°C/W
R
R
1.0
20
θJC
θJA
Peak Terminal Reflow Temperature During Solder Mounting (Note 7)
T
240
°C
W
SOLDER
Power Dissipation (TA = 25°C) (Note 8)
P
TBD
D
Notes
1. Exceeding voltage limits on INHS, INLS, CONF, CSNS, FS, TEMP, and EN terminals may cause a malfunction or permanent damage to the
device.
2. Continuous high-side output rating as long as maximum junction temperature is not exceeded. Calculation of maximum output current using
package thermal resistance is required.
3. ESD1 testing is performed in accordance with the Human Body Model (C
= 100 pF, R
= 1500 Ω).
ZAP
ZAP
4. ESD2 testing is performed in accordance with the Machine Model (C
= 200 pF, R
= 0 Ω) and in accordance with the system module
ZAP
ZAP
specification with a capacitor > 0.01 µF connected from OUT to GND.
5. Active clamp energy using single-pulse method (L = 16 mH, R = 0, VPWR = 12 V, TJ = 150°C).
L
6. Device mounted on a 2s2p test board per JEDEC JESD51-2.
7. Terminal soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
8. Maximum power dissipation at indicated ambient temperature in free air with no heatsink used.
33981
MOTOROLA ANALOG INTEGRATED CIRFCoUIrTMDEoVrICeEIDnAfToArmation On This Product,
5
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