Datasheet > P0402E1213BG

P0402E1213BG

更新时间： 2023-01-02 15:22:37

品牌	Logo	应用领域
威世 - VISHAY		/
页数	文件大小	规格书
9页	121K
描述
RESISTOR, THIN FILM, 0.063 W, 0.1 %, 25 ppm, 121000 ohm, SURFACE MOUNT, 0402, CHIP, GREEN

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P0402E1213BG 数据手册

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POPULAR OPTIONS

Vishay Sfernice

For any option it is recommended to consult Vishay Sfernice for availability first.

Option: Enlarged terminations:

For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint

can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink

(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA

Arrays, CHP Thick Film) www.vishay.com/doc?53048.

Option to order: 0063 (applies to size 1206/1505/2010).

DIMENSIONS (Option 0063) in millimeters

Bottom view for mounting

Uncoatted

ceramic

Enlarged

termination

MAX0 TOL0

+ ꢀ0152

MIN0 TOL0

- ꢀ0152

MAX0 TOL0

+ ꢀ0127

MIN0 TOL0

- ꢀ0127

MAX0 TOL0

+ ꢀ013

MIN0 TOL0

- ꢀ013

MAX0 TOL0

+ ꢀ013

MIN0 TOL0

- ꢀ013

CASE SIZE

NOMINAL

3.06

NOMINAL

1.60

NOMINAL

1.215

NOMINAL

MIN0

MAX0

1206

1505

2010

0.40

3.81

1.32

1.59

0.63

0.50

0.76

0.48

5.08

2.54

2.25

Note

Case size 2512 under development. Please consult Vishay Sfernice.

•

SUGGESTED LAND PATTERN (Option 0063)

G_min.

X_max.

Z_max.

DIMENSIONS (IN MILLIMETER)

G_min0

CHIP SIZE

Z_max0

X_max0

1.73

1.45

2.67

1206

1505

2010

3.91

4.66

5.93

0.50

Note

Case size 2512 under development. Please consult Vishay Sfernice.

•

Revision: 08-Sep-11

Document Number: 53017

For technical questions, contact: sfer@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

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