P
High Precision Wraparound - Wide Ohmic Value Range
Thin Film Chip Resistors
Vishay Sfernice
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heatsink
(see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film, PRA
Arrays, CHP Thick Film) www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206/1505/2010).
DIMENSIONS (Option 0063) in millimeters
Bottom view for mounting
Uncoatted
ceramic
A
Enlarged
termination
B
F
D
E
A
B
E
D
MAX. TOL.
+ 0.152
MIN. TOL.
- 0.152
MAX. TOL.
+ 0.127
MIN. TOL.
- 0.127
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
MAX. TOL.
+ 0.13
MIN. TOL.
- 0.13
F
CASE
SIZE
NOMINAL
3.06
NOMINAL
1.60
NOMINAL
NOMINAL
1.215
NOMINAL
MIN.
MAX.
1206
1505
2010
0.40
3.81
1.32
1.59
0.63
0.50
0.76
0.48
5.08
2.54
2.25
Note
• Case size 2512 under development. Please consult Vishay Sfernice.
SUGGESTED LAND PATTERN (Option 0063)
Gmin.
Xmax.
Zmax.
DIMENSIONS (in millimeter)
Gmin.
CHIP SIZE
Zmax.
Xmax.
1.73
1.45
2.67
1206
1505
2010
3.91
4.66
5.93
0.50
Note
• Case size 2512 under development. Please consult Vishay Sfernice.
Document Number: 53017
Revision: 10-Sep-09
For technical questions, contact: sfer@vishay.com
www.vishay.com
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