SIDACtor® ProtectionThyristors
Baseband Protection (Voice-DS1)
Soldering Parameters
Pb-Free assembly
(see Fig. 1)
Reflow Condition
Figure 1
tP
-Temperature Min (Ts(min)
)
+150°C
+200°C
TP
Critical Zone
L toTP
Ramp-up
-Temperature Max (Ts(max)
)
T
Pre Heat
-Time (Min to Max) (ts)
60-180 secs.
TL
tL
Average ramp up rate (LiquidusTemp (TL)
to peak)
TS(max)
3°C/sec. Max.
Ramp-down
TS(max) toTL - Ramp-up Rate
3°C/sec. Max.
+217°C
Preheat
-Temperature (TL) (Liquidus)
TS(min)
Reflow
tS
-Temperature (tL)
60-150 secs.
+260(+0/-5)°C
PeakTemp (TP)
25
time to peak temperature
(t 25ºC to peak)
Time within 5°C of actual PeakTemp (tp)
30 secs. Max.
Time
Ramp-down Rate
6°C/sec. Max.
8 min. Max.
+260°C
Time 25°C to PeakTemp (TP)
Do not exceed
Physical Specifications
Environmental Specifications
80% Rated VDRM (VAC Peak) +125°C or +150°C,
504 or 1008 hrs. MIL-STD-750 (Method 1040)
JEDEC, JESD22-A-101
HighTempVoltage
Blocking
Lead Material
Terminal Finish
Body Material
Copper Alloy
100% Matte-Tin Plated
-65°C to +150°C, 15 min. dwell, 10 up to 100
cycles. MIL-STD-750 (Method 1051) EIA/JEDEC,
JESD22-A104
Temp Cycling
UL Recognized epoxy meeting
flammability classification V-0
52 VDC (+85°C) 85%RH, 504 up to 1008 hrs. EIA/
JEDEC, JESD22-A-101
BiasedTemp &
Humidity
+150°C 1008 hrs. MIL-STD-750 (Method 1031)
JEDEC, JESD22-A-101
HighTemp Storage
LowTemp Storage
-65°C, 1008 hrs.
0°C to +100°C, 5 min. dwell, 10 sec. transfer,
10 cycles. MIL-STD-750 (Method 1056) JEDEC,
JESD22-A-106
Thermal Shock
Autoclave (Pressure
CookerTest)
+121°C, 100%RH, 2atm, 24 up to 168 hrs. EIA/
JEDEC, JESD22-A-102
Resistance to Solder
Heat
+260°C, 30 secs. MIL-STD-750 (Method 2031)
Moisture Sensitivity
Level
85%RH, +85°C, 168 hrs., 3 reflow cycles
(+260°C Peak). JEDEC-J-STD-020, Level 1
Additional Information
Dꢀtꢀsheet
ꢀesoꢁrces
Sꢀꢁꢂꢃes
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 02/23/17