Characteristics
P010xx
Unit
Table 6.
Symbol
Thermal resistance
Parameter
Maximum
Rth(j-a) Junction to case (DC)
Rth(j-t) Junction to tab (DC)
TO-92
SOT-223
80
30
°C/W
°C/W
TO-92
150
60
Rth(j-a) Junction to ambient (DC)
°C/W
°C/W
S
(1) = 5 cm2 SOT-223
Rth(j-a) Junction to ambient (mounted on FR4 with recommended pad layout) SOT23-3L
1. S = Copper surface under tab.
400
Figure 1.
Maximum average power
Figure 2.
Maximum average power
dissipation vs. average on-state
current P010xxA and P010xxN
dissipation vs. average on-state
current P010xxL
P(W)
P(W)
1.0
0.30
0.28
0.26
0.24
0.22
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0.02
0.00
α = 180°
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
α = 180°
360°
360°
α
I (A)
T(AV)
I
(A)
T(AV)
α
0.00
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
0.18
0.0
0.1
0.2
0.3
0.4
0.5
0.6
Figure 3.
Average and DC on-state current
vs. lead temperature
P010xxA and P010xxN
Figure 4.
Average and DC on-state current
vs. ambient temperature P010xxA
and P010xxN
I
(A)
T(AV)
I
(A)
T(AV)
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Device mounted on
FR4 with recomended
pad layout for SOT-223
D.C. (SOT-223)
D.C. (SOT-223)
D.C. (TO-92)
D.C. (TO-92)
α = 180° (SOT-223)
α = 180° (SOT-223)
α = 180° (TO-92)
α = 180° (TO-92)
T
lead
(°C)
T (°C)
amb
0
25
50
75
100
125
0
25
50
75
100
125
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