mni isionTM
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TECHNICAL BULLETIN
OmniVision Packaging Specifications
Last Modified: 3 February 2003
Document Version: 1.2
Revision Number
Date
Revision
1.0
1.1
1.2
04/02/02
10/09/02
02/03/03
Release to Marketing
Minor corrections
Add backend chip package specifications and minor corrections
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fringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or
sample.
OmniVision Technologies, Inc. disclaims all liability, including liability for infringement of any proprietary
rights, relating to the use of information in this document. No license, expressed or implied, by estoppel
or otherwise, to any intellectual property rights is granted herein.
* Third-party brands, names, and trademarks are the property of their respective owners.
Note:
The information contained in this document is considered proprietary to OmniVision Technologies, Inc. This
information may be distributed only to individuals or organizations authorized by OmniVision Technologies, Inc. to
receive said information. Individuals and/or organizations are not allowed to re-distribute said information