Datasheet > OPA2836QDGKRQ1

OPA2836QDGKRQ1

更新时间： 2024-02-13 18:41:58

品牌	Logo	应用领域
德州仪器 - TI		放大器运算放大器
页数	文件大小	规格书
43页	1173K
描述
汽车类双通道、超低功耗、轨到轨输出 VFB 运算放大器 \| DGK \| 8 \| -40 to 125

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OPA2836QDGKRQ1 数据手册

OPA2836-Q1

ZHCSFQ4 –DECEMBER 2016

www.ti.com.cn

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

MIN

MAX

5.5

UNIT

V_S–to V_S+

Supply voltage

V_I

V_ID

I_I

Input voltage

V_S–– 0.7

V_S++ 0.7

Differential input voltage

Continuous input current

Continuous output current

Continuous power dissipation

Maximum junction temperature

Operating free-air temperature

Storage temperature

0.85

I_O

See Thermal Information

T_J

150

125

150

°C

T_A

–40

–65

T_stg

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

±6000

±1000

UNIT

Human body model (HBM), per AEC Q100-002⁽¹⁾

Charged-device model (CDM), per AEC Q100-011

V_(ESD)

Electrostatic discharge

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

2.5

NOM

MAX

5.5

UNIT

V_S+

T_A

Single supply voltage

Ambient temperature

–40

125

°C

7.4 Thermal Information

OPA2836-Q1

DGK (VSSOP)

8 PINS

177.7

THERMAL METRIC⁽¹⁾

UNIT

R_θJA

R_θJCtop

R_θJB

ψ_JT

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

69.3

98.8

Junction-to-top characterization parameter

Junction-to-board characterization parameter

11.7

ψ_JB

97.2

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

1 2 345 6 7...43

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