2N7002W

更新时间： 2024-02-10 15:15:34

品牌	Logo	应用领域
安森美 - ONSEMI		晶体小信号场效应晶体管
页数	文件大小	规格书
5页	103K
描述
Small Signal MOSFET 60 V, 340 mA, Single, N−Channel, SC−70

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技术参数
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2N7002W 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	compliant	ECCN代码：	EAR99
风险等级：	5.55	Is Samacsys：	N
湿度敏感等级：	1	峰值回流温度（摄氏度）：	260
处于峰值回流温度下的最长时间：	10	Base Number Matches：	1

2N7002W 数据手册

2N7002W

Small Signal MOSFET

60 V, 340 mA, Single, N−Channel, SC−70

Features

• ESD Protected

http://onsemi.com

• Low R

DS(on)

• Small Footprint Surface Mount Package

• This is a Pb−Free Device

DS(on)

MAX

I MAX

(Note 1)

(BR)DSS

60 V

1.6 W @ 10 V

2.5 W @ 4.5 V

340 mA

Applications

• Low Side Load Switch

• Level Shift Circuits

• DC−DC Converter

• Portable Applications i.e. DSC, PDA, Cell Phone, etc.

Simplified Schematic

Gate

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

Rating

Drain−to−Source Voltage

Gate−to−Source Voltage

Symbol

Value

Unit

Drain

DSS

Source

±20

Drain Current (Note 1)

Steady State

T = 25°C

310

220

(Top View)

T = 85°C

t < 5 s

T = 25°C

340

240

T = 85°C

MARKING DIAGRAM

& PIN ASSIGNMENT

Power Dissipation (Note 1)

Steady State

t < 5 s

280

330

Drain

Pulsed Drain Current (t = 10 ms)

1.4

Operating Junction and Storage

Temperature Range

T , T

−55 to

°C

STG

+150

SC−70/SOT−323

CASE 419

Source Current (Body Diode)

250

260

STYLE 8

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

°C

Gate

Source

Gate−Source ESD Rating

ESD

900

= Device Code

= Pb−Free Package

(HBM, Method 3015)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

ORDERING INFORMATION

†

Device

2N7002WT1G

Package

Shipping

THERMAL CHARACTERISTICS

SC−70

(Pb−Free)

3000/Tape & Reel

Characteristic

Symbol

Max

Unit

Junction−to−Ambient − Steady State

(Note 1)

450

°C/W

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Junction−to−Ambient − t ≤ 5 s (Note 1)

375

1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in

sq [1 oz] including traces)

Semiconductor Components Industries, LLC, 2007

Publication Order Number:

April, 2007 − Rev. 2

2N7002W/D

12 3 4 5

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