Datasheet > NX30TA-25PAA(50)

NX30TA-25PAA(50)

更新时间： 2024-02-12 12:26:14

品牌	Logo	应用领域
广濑 - HRS		连接器
页数	文件大小	规格书
16页	606K
描述
Telecom and Datacom Connector

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技术参数
数据手册

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NX30TA-25PAA(50) 技术参数

是否Rohs认证：	符合	生命周期：	Active
Reach Compliance Code：	unknown	ECCN代码：	EAR99
HTS代码：	8536.69.40.30	风险等级：	2.29
连接器类型：	TELECOM AND DATACOM CONNECTOR	Base Number Matches：	1

NX30TA-25PAA(50) 数据手册

NEW

I/O Card Interface Connectors

NX Series

3. ESD Secure

Thermoplastic molded covers assures insulation

of the connections and shields from ESD.

4. Secure Latching

A built-in latch assures correct and secure

mating of connector.

5. Reliable Conductor Termination

Reliable termination of conductors is

accomplished by proven IDC termination.

6. Sequential Mating

The 0.8mm pitch contacts are engaging the

corresponding parts in sequence: Ground-

Power & Signal

7. Rugged Construction

Securely attached to the board with optional

screws.

■Features

1. Low Profile

8. Card Frame Kits

Protorusion above the PCB board is only 2.9mm, and the

connectors can be mounted to type I and II I/O cards.

Available as a separate part number.

9. Secure Attachment to Frame Kit.

Compliant mounting bracket attaches the

connectore directly to the frame kit.

2. EMI/RFI protection

Full metal shielding. Shield connects first, ahead of

contacts.

■Applications

Used with I/O cards, portable personal computers,and the external connections of various small-sized portable

terminals.

■Specifications

Current

0.5 A

Operating temperature

Operating humidity

-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)

Ratings

95% R.H. or less

(No condensation)

Voltage

125 V AC

Storage humidity range

40 to 70% (Note 2)

Item

Requirements

Conditions

1. Insulation resistance

2. Voltage proof

Measured at 100 V DC

250 Mø or greater

300 V AC for 1 minute

Measured at 100 mA

No flashover or breakdown

3. Contact resistance

40 mø or less (initial value) (Note 3)

No electrical discontinuity for 10µs or

greater

Frequency of 10 to 55 Hz, amplitude of 0.75 mm,

3 directions, 2 hours each

4. Vibration

Temperature of 40ç 2ç, humidity of 90 to 95%,

duration 96h

5. Humidity resistance

Insulation resistance: 250 Mø or greater

6. Rapid change

of temperature

No damage, cracks, or defects at any

part

-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min

/15 to 35ç, within 5 min, for 5 cycles

7. Insertion and

withdrawal life

Change of contact resistance from the

start should be 60 mø or less

3,000 times

Reflow: at the recommended temperature profile

8. Resistance to

soldering heat

No melting of resin portions which affect

performance

Soldering iron temperature: 300ç for 3 seconds

Note 1 : Includes temperature rise when conducting.

Note 2 : The term storage refers to an unused products prior to boards mounting (including packing materials) that is being kept for

a long period.

The operating temperature and humidity range are applied to the non-conducting condition following board assembly.

Note 3 : The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.

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