Datasheet (CN) 1.3
NSPGD1 Series
目录
1. 封装及引脚定义..................................................................................................................................................................... 3
2. 最大额定参数......................................................................................................................................................................... 4
3. 推荐工作范围......................................................................................................................................................................... 4
4. 技术规格................................................................................................................................................................................. 5
4.1
4.2
电气参数 ......................................................................................................................................................................... 5
I2C 通讯电气特性............................................................................................................................................................ 5
5. 功能描述................................................................................................................................................................................. 6
5.1
5.2
5.3
概述 ................................................................................................................................................................................. 6
模拟输出传递函数 ......................................................................................................................................................... 6
数字 I2C 输出传递函数................................................................................................................................................... 7
5.3.1 寄存器定义 ....................................................................................................................................................................... 7
5.4
5.5
频率输出传递函数 ......................................................................................................................................................... 8
I2C 通讯接口协议............................................................................................................................................................ 9
6. 应用指南............................................................................................................................................................................... 10
6.1 应用电路 ....................................................................................................................................................................... 10
7. 封装信息............................................................................................................................................................................... 11
7.1
7.2
产品封装尺寸 ............................................................................................................................................................... 11
焊盘建议尺寸 ............................................................................................................................................................... 12
8. 订购信息............................................................................................................................................................................... 12
9. 丝印信息............................................................................................................................................................................... 13
10.
11.
包装信息........................................................................................................................................................................... 13
修订历史........................................................................................................................................................................... 13
NOTES: ....................................................................................................................................................................................... 14
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