NP89 Series
Pin Grid Array / Zero Insertion Force (PGA / ZIF)
Specifications
Part Number(Details)
W
1,000M min. at 500V DC
Insulation Resistance:
-
-
-
NP89
Series No.
121 10 MF G 4
BF
Dielectric Withstanding Voltage:700V AC for 1 minute
Contact Resistance:
Operating Temperature Range: –40°C to +170°C
W
30m max. at 10mA/20mV max.
No. of Contact Pins
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled, UL94V-0
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
MF =Flanged
Unmarked = Not Flanged
Contact Plating (Gold)
Contact Terminal Style
Plating Specification
Features
í
Wiping action system: Cleans up IC lead surface during
handling action
Reliable 3 point contact system
í
Standard lever left side
í
Cost performance: Different contact thickness for contact area
and terminal area
í Depopulated versions available
Also available with lever on the right hand side, standard type
is lever on the left hand side
í
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
A
B
9.0
C
2.54
2-Æ3.2
Æ0.8
7.5
D
2- Æ3.2
G
B
F
E
Socket and PC Board Dimensions
Grid
Size
Pin
Count
Part Number
A
B
C
D
E
F
G
NP89-12110**-G4-BF 11 x 11
NP89-14409**-G4-BF 12 x 12
NP89-13302**-G4-BF 14 x 14
NP89-19601**-G4-BF 14 x 14
NP89-22508**-G4-BF 15 x 15
NP89-21004**-G4-BF 17 x 17
NP89-28906**-G4-BF 17 x 17
NP89-36105**-G4-BF 19 x 19
NP89-44111**-G4-BF 21 x 21
NP89-62522**-G4-BF 25 x 25
121
144
133
196
225
210
289
361
441
625
42.5
43.1
51.0
51.0
52.7
59.0
59.0
63.7
69.0
85.7
25.4
14.0
12.0
42.5
42.7
51.0
49.0
50.3
57.0
57.0
61.7
68.0
82.0
52.0
52.6
60.5
60.5
65.4
71.7
71.7
73.2
81.7
95.2
50.1
50.7
58.6
58.6
60.3
66.6
66.6
71.3
76.4
92.8
17.55
15.55
18.2
18.2
17.55
18.2
18.2
18.2
18.5
21.5
27.94
32.02
32.02
35.56
40.64
40.64
45.72
50.8
14.65
14.65
14.0
14.65
14.65
14.65
14.95
17.95
60.96
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE
–
DIMENSIONS IN MILLIMETER
Test & Burn-In